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| | | Sil-Pad AI500 | | |
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| | | Electrically Insulating,Thermally Conductive Elastomeric Material | | |
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| | | | | | | | | | | | | TYPICAL PROPERTIES OF SIL-PAD AI500 | | | | PROPERTY | IMPERIAL VALUE | METRIC VALUE | TEST METHOD | | | | Color | Green | Green | Visual | | | | Reinforcement Carrier | Fiberglass | Fiberglass | — | | | | Thickness (inch) / (mm) | 0.010 | 0.254 | ASTM D374 | | | | Hardness (Shore A) | 80 | 80 | ASTM D2240 | | | | Breaking Strength (lbs/inch) / (kN/m) | 65 | 12 | ASTM DI458 | | | | Elongation (% - 45° to Warp and Fill) | 40 | 40 | ASTM D4I2 | | | | Continuous Use Temp (°F) / (°C) | -76 to 356 | -60 to 180 | — | | | | ELECTRICAL | | | | Dielectric Breakdown Voltage (Vac) | 6000 | 6000 | ASTM DI49 | | | | Dielectric Constant (1000 Hz) | 7.0 | 7.0 | ASTM DI50 | | | | Volume Resistivity (Ohm-meter) | I011 | I011 | ASTM D257 | | | | Flame Rating | V-O | V-O | U.L. 94 | | | | THERMAL | | | | Thermal Conductivity (W/m-K) | 2.0 | 2.0 | ASTM D5470 | | | | THERMAL PERFORMANCE vs PRESSURE | | | | Pressure (psi) | 10 | 25 50 | 100 200 | | | | TO-220 Thermal Performance (°C/W) | 3.03 | 2.62 2.21 | 1.92 1.78 | | | | Thermal Impedance (°C-in2/W) (I) | 0.59 | 0.50 0.42 | 0.34 0.31 | | | | 1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness.flatness and pressure applied. | | | | | | | | | | | | |
| | | Features and Benefits • Thermal impedance: 0.42°C-in2/W (@50 psi) • Elastomeric compound coated on both sides | | |
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| | | Bergquist Sil-Pad AI500 is a silicone-based, thermally conductive and electrically insulating material. It consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer. Sil-Pad AI500 performs well under clamping pressure up to 200 psi and is an excellent choice for high performance applications requiring electrical isolation and cut-through resistance. | | |
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| | | Typical Applications Include: • Power supplies • Automotive electronics • Motor controls • Power semiconductors Configurations Available: • Sheet form, die-cut parts, and roll form • With or without pressure sensitive adhesive | | |
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| | | Building a Part Number | | Standard Options H example | | |
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| | | SPAI500 | | NA | | |
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| | | NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. ___= Standard configuration dash number, 1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard thicknesses available: 0.010" SPAI500 = Sil-Pad AI500 Material | | |
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| | | Note: To build a part number, visit our website at www.bergquistcompany.com. Sil-Pad®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others | | |
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