Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Adhesive, Membrane keyboard, Touch screen, Keyboard, Thermally conductive material

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Hi-Flow® 300G

Fiberglass-Reinforced, Phase Change Thermal Interface Material


TYPICAL PROPERTIES OF HI-FLOW 300G
PROPERTY	IMPERIAL VALUE		METRIC VALUE	TEST METHOD
Color	Green		Green	Visual
Reinforcement Carrier	Fiberglass		Fiberglass	—
Thickness (inch) / (mm)	0.005		0.127	ASTM D374
Elongation (%45° to Warp and Fill)	40		40	ASTM D882A
Tensile Strength (psi) / (MPa)	400		3	ASTM D882A
Continuous Use Temp (°F) / (°C)	212		I00	—
Phase Change Temp (°F) / (°C)	131		55	ASTM 3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	300		300	ASTM DI49
Dielectric Constant (I000 Hz)	3.5		3.5	ASTM DI50
Volume Resistivity (Ohm-meter)	I0⁸		I0⁸	ASTM D257
Flame Rating	V-O		V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (I)	1.6		I.6	ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)		10	25 50	100 200
TO-220 Thermal Performance (°C/W)		0.96	0.92 0.88	0.85 0.84
Thermal Impedance (°C-in²/W) (2)		0.27	0.20 0.I6	0.I5 0.I4
1) This is the measured thermal conductivity of the Hi-Flow coating.It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470.Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only.Actual application performance is directly related to the surface roughness,flatness and pressure applied.

Features and Benefits

• Thermal impedance: 0.20°C-in²/W (@25 psi)

• Will not drip or run like grease

• Phase change compound coated on a fiberglass carrier

Hi-Flow 300G consists of a thermally conductive 55°C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and a heat sink

Above the phase change temperature, Hi-Flow 300G wets-out the thermal interface surfaces and flows to produce low thermal impedance.The material requires pressure of the assembly to cause flow. Hi-Flow 300G will not drip or run like grease.

Application Methods

1. Hand-apply to 40°- 50°C heat sinkThe heat sink is heated in an oven or by a heat gun

to between 40°- 50°C allowing the Hi-Flow

300G pad to be applied like an adhesive pad. The heat sink is then cooled to room temperature and packaged.

2. Hand-apply to 20°- 35°C heat sink Hi-Flow 300G can be applied to a room temperature heat sink with the assistance of a foam rollerThe pad is positioned on the heat sink and a hand roller is used to apply pressure of 30 psi.

3. Automated equipment with 30 psi pressure. A pick-and-place automated dispensing unit can be used to apply Hi-Flow 300G to a room temperature heat sinkThe placement head should have a soft silicone rubber pad, and apply 30 psi pressure to the pad on transfer to the 20°- 35°C heat sink.

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Typical Applications Include:

• Computer and peripherals

• As a thermal interface where bare die is exposed and needs to be heat sinked

Configurations Available:

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive

Building a Part Number

Standard Options

H example

HF300G

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

___= Standard configuration dash number,

1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or 00 = custom configuration

AC = Adhesive, one side 00 = No adhesive

Standard thicknesses available: 0.005"

<D Si

О SI

0 SI

- HF300G = Hi-Flow 300G Phase Change Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Hi- Flow®: U.S. Patent 6,197,859 and others

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Thermal Interface Selection Guide - Bergquist Company - #44

Adhesive, Membrane keyboard, Touch screen, Keyboard, Thermally conductive material