Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Hi-Flow® 300P

Electrically Insulating,Thermally Conductive Phase Change Material

Features and Benefits

• Thermal impedance: 0.I3°C-in²/W (@25 psi)

• Field-proven polyimide film

- excellent dielectric performance

- excellent cut-through resistance

• Outstanding thermal performance in an insulated pad

TYPICAL PROPERTIES OF HI-FLOW 300P


PROPERTY	IMPERIAL VALUE		METRIC VALUE	TEST METHOD
Color	Green		Green	Visual
Reinforcement Carrier	Polyimide		Polyimide	—
Thickness (inch) / (mm)	0.004	0.005	0.102 - 0.127	ASTM D374
Film Thickness (inch) / (mm)	0.001	0.002	0.025 - 0.050	ASTM D374
Elongation (%45° to Warp and Fill)	40		40	ASTM D882A
Tensile Strength (psi) / (MPa)	7000		48	ASTM D882A
Continuous Use Temp (°F) / (°C)	302		150	—
Phase Change Temp (°F) / (°C)	131		55	ASTM D34I8
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	5000		5000	ASTM DI49
Dielectric Constant (1000 Hz)	4.5		4.5	ASTM DI50
Volume Resistivity (Ohm-meter)	I0¹²		I0¹²	ASTM D257
Flame Rating	V-O		V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)	1.6		I.6	ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)		10	25 50	100 200
TO-220 Thermal Performance (°C/W) 0.0010"		0.95	0.94 0.92	0.91 0.90
TO-220 Thermal Performance (°C/W) 0.0015"		1.19	1.17 1.16	1.14 1.12
TO-220 Thermal Performance (°C/W) 0.0020"		1.38	1.37 1.35	1.33 1.32
Thermal Impedance (°C-in²/W) 0.0010" (2)		0.13	0.I3 0.I2	0.I2 0.I2
Thermal Impedance (°C-in²/W) 0.0015" (2)		0.17	0.I6 0.I6	0.I6 0.I5
Thermal Impedance (°C-in²/W) 0.0020" (2)		0.19	0.I9 0.I9	0.I8 0.I8

Hi-Flow 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems.

Hi-Flow 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition.The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.

Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application.

■

-n r-

) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes nterfacial thermal resistance.These values are provided for reference only.Actual application performance is directly related to the surface roughness, flatness and pressure applied

Typical Applications Include:

• Spring / clip mounted

• Discrete power semiconductors and modules

Configurations Available:

• Roll form, die-cut parts and sheet form, with or without pressure sensitive adhesive

Building a Part Number

Standard Options

И example

HF300P

ACMEI0256 Rev a

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

___= Standard configuration dash number

1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration

AC = Adhesive, one side 00 = No adhesive

Standard polyimide thicknesses available: 0.001", 0.0015",

0.002"

Sì

о 1Л

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Hl-Flow 300P Polyimide Hi-Flow 300P

- HF300P = Hi-Flow 300P Phase Change Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Hi- Flow®: U.S. Patent 6,197,859 and others

We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part.

BEDD0UI5T

• COM P A N Y •

Thermal Interface Selection Guide - Bergquist Company - #43

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