Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Thermally conductive material, Adhesive, Keyboard, Printed circuit board, Touch screen

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Hi-Flow® 625

Electrically Insulating,Thermally Conductive Phase Change Material


TYPICAL PROPERTIES OF HI-FLOW 625
PROPERTY	IMPERIAL VALUE		METRIC VALUE	TEST METHOD
Color	Green		Green	Visual
Reinforcement Carrier	PEN Film		PEN Film	—
Thickness (inch) / (mm)	0.005		0.127	ASTM D374
Elongation (%45° to Warp and Fill)	60		60	ASTM D882A
Tensile Strength (psi) / (MPa)	30,000		206	ASTM D882A
Continuous Use Temp (°F) / (°C)	302		150	—
Phase Change Temp (°F) / (°C)	149		65	ASTM D34I8
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	4000		4000	ASTM DI49
Dielectric Constant (1000 Hz)	3.5		3.5	ASTM DI50
Volume Resistivity (Ohm-meter)	I0¹⁰		I0¹⁰	ASTM D257
Flame Rating	V-O		V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)	0.5		0.5	ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)		10	25 50	100 200
TO-220 Thermal Performance (°C/W)		2.26	2.10 2.00	1.93 1.87
Thermal Impedance (°C-in²/W) (2)		0.79	0.71 0.70	0.67 0.61
1) This is the measured thermal conductivity of the Hi-Flow coating.It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470.Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only.Actual application performance is directly related to the surface roughness.flatness and pressure applied.

Features and Benefits

• Thermal impedance: 07l°C-in7W (@25 psi)

• Electrically isolating

• 65°C phase change compound coated on PEN film

• Tack-free and scratch-resistant

Hi-Flow 625 is a film-reinforced phase change material.The product consists of a thermally conductive 65°C phase change compound coated on PEN film. Hi-Flow 625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.The reinforcement makes Hi-Flow 625 easy to handle, and the 65°C phase change temperature of the coating material eliminates shipping and handling problems.The PEN film has a continuous use temperature of I50°C.

Hi-Flow 625 is tack-free and scratch-resistant at production temperature and does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.

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Typical Applications Include:

• Spring / clip mounted

• Power semiconductors

• Power modules

Configurations Available:

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive

Building a Part Number

Standard Options

Ü example

HF625

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

___= Standard configuration dash number,

1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or 00 = custom configuration

AC = Adhesive, one side 00 = No adhesive

Standard thicknesses available: 0.005"

- HF625 = Hi-Flow 625 Phase Change Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Hi- Flow®: U.S. Patents 6,197,859 and 5,950,066.

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*■ COM PANY-

Thermal Interface Selection Guide - Bergquist Company - #42

Thermally conductive material, Adhesive, Keyboard, Printed circuit board, Touch screen