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Hi-Flow

®

225UT

Non-Reinforced,Pressure Sensitive Phase Change Thermal Interface Material Features and Benefits

TYPICAL PROPERTIES OF HI-FLOW 225UT • Thermal impedance:0.08°C-in

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
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/W (@25 psi)• 55°C phase change composite withinherent tack characteristics• High-visibility protective tabs • Pressure sensitive phase change thermalinterface material Hi-Flow 225UT is designed as a pressuresensitivethermal interface material for use between a high performance processor and a heat sink.Hi-Flow 225UT is a thermally conductive 55°C phase change composite with inherent tack.The material is supplied on a polyester carrier liner and is available with high-visibility protective tabs.Above its phase change temperature,Hi-Flow225UT wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance.The material requires pressure of the assembly to cause flow.Hi-Flow 225UT coatings will resist dripping.

Color Black Black Visual Reinforcement Carrier None None — Thickness (inch) / (mm) 0.003 0.077 ASTM D374 Continuous Use Temp (°F) / (°C) 248 120 — Phase Change Temp (°F) / (°C) 131 55 ASTM D3418 ELECTRICAL Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) (1) 0.7 0.7 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (°C/W) 0.60 0.53 0.46 0.40 0.35 Thermal Impedance (°C-in
2 /W) (2) 0.09 0.08 0.07 0.06 0.05
1) This is the measured thermal conductivity of the Hi-Flow coating.It represents one conducting layer in a three-layer laminate.TheHi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivityof the material in post-phase change,thin film products is highly dependent upon the heat and pressure applied.This characteristic isnot accounted for in ASTM D5470.Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only.Actual application performance is directly related to thesurface roughness,flatness and pressure applied.

Typical Applications Include:

• Computer and peripherals• High performance computer processors • Graphic cards • Power modules

HI-FLOW

Configurations Available:

Clear PolyesterCarrier Liner HF 225UTRoll Form,Kiss-Cut PartsClear/ColoredProtective Tab Adhesive Strip"Quick-Snap" High VisibilityTab for Removal

• Roll form with tabs and kiss-cut parts – no holes Hi-Flow 225UT is limited to a square or rectangular part design.Dimensional tolerance is+/- 0.020 inch (0.5mm).

Building a Part NumberStandard Options

Application Methods:

1.Hand-apply Hi-Flow 225UT to a room-temperature heat sink.The Hi-Flow 225UT pad exhibits inherent tack and can be hand-applied similar to an adhesive pad. The tab liner can remain on the heat sink and pad throughout shipping and handling until is it is ready for final assembly.

Hi- Flow
® : U.S. Patent 6,197,859 and others

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