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Hi-Flow

®

225FT

Reworkable,Pressure Sensitive Phase Change Material Features and Benefits

TYPICAL PROPERTIES OF HI-FLOW 225FT • Thermal impedance:0.10°C-in

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
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/W (@25 psi)• Reworkable pressure sensitive • Tabbed parts for easy application • Compliant foil allows easy releaseand rework Bergquist reworkable Hi-Flow 225FT thermalinterface material provides a low thermal resistance path between hot components such as high performance processors and heat sinks.The material consists of a 55°C phase change compound bonded to one side of a conformable metal foil.This pressure sensitive material is easily applied to the heat sink and securely conforms to many mounting surfaces.Its compliant foil allows for easy release and reworking without leaving residue on CPU surfaces.Above the 55°C phase change temperature,Hi-Flow 225FT wets-out the heat sink interface and flows to produce exceptional thermal performance.The thixotropic design of Hi-Flow 225FT requires pressure of the assembly to cause displacement and/or flow.

Color Black Black Visual Reinforcement Carrier Aluminum Aluminum — Thickness (inch) / (mm) 0.004 0.102 ASTM D374 Carrier Thickness (inch) / (mm) 0.001 0.025 ASTM D374 Continuous Use Temp (°F) / (°C) 248 120 — Phase Change Temp (°F) / (°C) 131 55 ASTM D3418 ELECTRICAL Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) (1) 0.7 0.7 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (°C/W) 0.93 0.74 0.63 0.52 0.42 Thermal Impedance (°C-in
2 /W) (2) 0.13 0.10 0.09 0.07 0.06
1) This is the measured thermal conductivity of the Hi-Flow coating.It represents one conducting layer in a three-layer laminate.TheHi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivityof the material in post-phase change,thin film products is highly dependent upon the heat and pressure applied.This characteristic isnot accounted for in ASTM D5470.Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only.Actual application performance is directly related to thesurface roughness,flatness and pressure applied.

Typical Applications Include:

• Computer and peripherals• High performance computer processors • Burn-in testing • Heat pipes • Mobile processors

HI-FLOW Clear PolyesterCarrier Liner HF 225FTRoll Form,Kiss-Cut PartsCompliant FoilProtects Hi-FlowLow Adhesion to the Linerfor Ease of Removal

Configurations Available:

• Roll form with tabs and kiss-cut parts – no holes • Custom thicknesses available Hi-Flow 225FT is limited to a square or rectangular part design.Dimensional tolerance is+/- 0.020 inch (0.5mm).

Building a Part NumberStandard Options

Application Methods

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1.Hi-Flow 225FT pads are easily removedfrom the carrier liner and can be hand- applied to a room temperature heat sink, foil-side exposed.To reposition the heat sink assembly,simply lift gently to remove and reapply.

NA = Selected standard option. If not selecting a standardoption, insert company name, drawing number, andrevision level. HF225FT = Hi-Flow 225FT Phase Change Material HF225FT0.004011112NA Section ASection BSection CSection DSection E Standard thicknesses available: 0.004"01 = Reworkable adhesive, one side_ _ _ = Standard Hi-Flow 225FT configuration,11/250 = 11" x 250' rolls, or 00 = custom configuration Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow
® : U.S. Patent 6,197,859 and others

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