Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Hi-Flow® 225F-AC

Reinforced, Phase Change Thermal Interface Material


TYPICAL PROPERTIES OF HI-FLOW 225F-AC
PROPERTY	IMPERIAL VALUE		METRIC VALUE	TEST METHOD
Color	Black		Black	Visual
Reinforcement Carrier	Aluminum		Aluminum	—
Thickness (inch) / (mm)	0.004		0.102	ASTM D374
Carrier Thickness (inch) / (mm)	0.0015		0.038	ASTM D374
Continuous Use Temp (°F) / (°C)	248		120	—
Phase Change Temp (°F) / (°C)	131		55	ASTM D34I8
ELECTRICAL
Flame Rating	V-O		V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)	1.0		1.0	ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)		10	25 50	100 200
TO-220 Thermal Performance (°C/W)		0.87	0.68 0.57	0.50 0.45
Thermal Impedance (°C-in²/W) (2)		0.12	0.10 0.09	0.08 0.07
1) This is the measured thermal conductivity of the Hi-Flow coating.It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470.Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness.fatness and pressure applied.

Features and Benefits

• Thermal impedance: 0.I0°C-in²/W (@25 psi)

• Can be manually or automatically applied to the surfaces of room-temperature heat sinks

• Foil reinforced, adhesive-coated

• Soft, thermally conductive 55°C phase change compound

Hi-Flow 225F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. Hi-Flow 225F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.

Above the 55°C phase change temperature, Hi-Flow 225F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance.

Hi-Flow 225F-AC requires pressure from the assembly to cause material flow. The Hi-Flow coatings resist dripping in vertical orientation.

The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly Please contact Bergquist Product Management for applications that are less than 0.07" square.

Typical Applications Include:

• Computer and peripherals

• Power conversion

• High performance computer processors

• Power semiconductors

• Power modules

Configurations Available:

• Roll form, kiss-cut parts, and sheet form

Building a Part Number

HF225FAC - 0.004 -jAC -11/250 - NA

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-n

Standard Options

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

___= Standard configuration dash number

1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration

AC = Adhesive, one side

Standard thicknesses available: 0.004"

cu Si

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- HF225FAC = Hi-Flow 225F-AC Phase Change Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Hi- Flow®: U.S. Patent 6,197,859 and others

Heat Sink

AC (Tackified Hi-Flow) Aluminum Foil Hi-Flow 225F-AC

Microprocessor

BEDDUUI5T

• COM P A N Y •

Thermal Interface Selection Guide - Bergquist Company - #37

Touch screen, Thermally conductive material, Keyboard, Membrane keyboard, Printed circuit board