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Hi-Flow

®

105

Phase Change Coated Aluminum Features and Benefits

TYPICAL PROPERTIES OF HI-FLOW 105 • Thermal impedance:0.37°C-in

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
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/W (@25 psi)• Used where electrical isolation isnot required• Low volatility – less than 1% • Easy to handle in the manufacturingenvironment• Flows but doesn’t run like grease Hi-Flow 105 is a phase change material coatedon both sides of an aluminum substrate.It is designed specifically to replace grease as a thermal interface,eliminating the mess, contamination and difficult handling associated with grease.Hi-Flow 105 is tack-free and scratch resistant at room temperature and does not require a protective liner in shipment when attached to a heat sink.At 65°C (phase change temperature),Hi-Flow105 changes from a solid and flows, thereby assuring total wet-out of the interface. The thixotropic characteristics of Hi-Flow105 reduce the pump-out from the interface.Hi-Flow105 has thermal performance equalto grease with 0.10°C-in

Color Dark Gray Dark Gray Visual Reinforcement Carrier Aluminum Aluminum — Thickness (inch) / (mm) 0.0055 0.139 ASTM D374 Continuous Use Temp (°F) / (°C) 266 130 — Phase Change Temp (°F) / (°C) 149 65 ASTM D3418 ELECTRICAL Dielectric Constant (1000 (Hz) 3.2 3.2 ASTM D150 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) (1) 0.9 0.9 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (°C/W) 0.95 0.80 0.74 0.69 0.64 Thermal Impedance (°C-in
2 /W) (2) 0.39 0.37 0.36 0.33 0.30
1) This is the measured thermal conductivity of the Hi-Flow coating.It represents one conducting layer in a three-layer laminate.TheHi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivityof the material in post-phase change,thin film products is highly dependent upon the heat and pressure applied.This characteristic isnot accounted for in ASTM D5470.Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only.Actual application performance is directly related to thesurface roughness,flatness and pressure applied.

Typical Applications Include:

• Power semiconductors• Microprocessors mounted on a heat sink • Power conversion modules • Spring or clip mount applications where thermal grease is used

HI-FLOW

Configurations Available:

• Sheet form,die-cut partsand roll form • With or without pressure sensitive adhesive

Building a Part NumberStandard Options

–––– NA = Selected standard option. If not selecting a standardoption, insert company name, drawing number, and revision level. HF105 = Hi-Flow 105 Phase Change Material HF1050.0055AC12/250NA 2

/W contact thermalresistance.

Section ASection BSection CSection DSection E Standard thicknesses available: 0.0055"AC = Adhesive, one side00 = No adhesive_ _ _ = Standard configuration dash number,1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or00 = custom configuration Note: To build a part number, visit our website at www.bergquistcompany.com. Hi- Flow
® : U.S. Patents 6,197,859 and 5,950,066.

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