Thermal Interface Selection Guide - Bergquist Company - #32

Solutions-Driven Thermal Management Products for Electronic Devices

Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink.The materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface without overflow. The result is a thermal interface comparable to grease, without the mess, contamination and hassle.

The Hi-Flow family of phase change thermal interface materials covers a wide range of applications.The Bergquist Company is a leader in thermal management solutions and works closely with customers to ensure that the proper Hi-Flow material is specified.

Using Hi-Flow materials instead of grease can save time and money without sacrificing thermal performance. Here are some other benefits:

• No mess - thixotropic charac­teristics of the materials keep it from flowing out of the interface

• Easier handling - tackified or tack-free at room temperature

• Does not require protective liner

• High thermal performance helps ensure CPU reliability

• Does not attract contaminants

• Easier material handling and shipping

• Simplified application process

Hi-Flow handles like Bergquist's famed Sil-Pad materials at room temperature, but flows like grease at its designed phase change temperature.The following is an overview of the important features shared by the Hi-Flow family:

• Comparable thermal performance to grease in most applications

• Thermally conductive phase change compound

• Aluminum, film or fiberglass carriers and non-reinforced versions

• Low volatility

• Easy to handle and apply in the manufacturing environment

• Tackified or tack-free at room temperature

The broad Hi-Flow family offers a variety of choices to meet the customer's performance, handling and process needs. Some of the choices include:

• Some Hi-Flows are available with or without adhesive

• Aluminum carrier for applications not requiring electrical isolation

• Film or fiberglass carrier for electrical isolation

• Dry non-reinforced material

• Tackified or tack-free at room temperature

• Tabbed parts, die-cut parts, sheets or bulk rolls

• Adhesive specifically for cold application without preheating heat sink

We produce thousands of specials. Tooling charges vary depending on the complexity of the part.

Hi-Flow materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunica­tions applications such as:

• UPS and SMPS AC/DC, DC/DC or linear power supplies

• Between a CPU and heat sink

• Power conversion devices

• Fractional and integral motor control

• Leaded, surface mount and power module assemblies

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U.S. Patent 5,679,457 and others.

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