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TIC

™

4000

High Performance Thermal Interface Compound for Copper-Based Heat Sinks Features and Benefits

TYPICAL PROPERTIES OF TIC 4000 • Thermal conductivity:4.0 W/m-K• Exceptional thermal performance:0.19°C/W @ 50 psi TIC 4000 is a thermally conductive greasecompound designed for use as a thermal inter- face material between a computer processor and a copper-based heat sink.Other high watt density applications will benefit from theextremely low thermal impedanceofTIC 4000.TIC 4000 compound wets-out the thermalinterface surfaces and flows to produce low thermal impedance.The compound requires pressure of the assembly to cause flow. TIC 4000 compound will not drip.For a typical 0.5" x 0.5" application at 0.005"thick,Bergquist estimates approximately 0.02 ml (cc) ofTIC 4000.Although Bergquist estimates a 0.02 ml (cc)volumetric requirement for a 0.5" x 0.5" component interface,dispensed at a thickness of 0.005",Bergquist also recognizes that an optimized application would utilize the minimum volume ofTIC 4000 material necessary to ensure complete wet-out of both mechanical interfaces.

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Color Gray Gray Visual Density (g/cc) 4.0 4.0 ASTM D792 Continuous Use Temp (°F) / (°C) 302 150 — ELECTRICAL Electrical Resistivity (Ohm-meter) (1) N/A N/A ASTM D257 THERMAL Thermal Conductivity (W/m-K) 4.0 4.0 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (°C/W) (2)0.210.200.190.190.18
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin.2) TO-220 performance data is provided as a reference to compare material thermal performance.

Application Methods

1.Pre-clean heat sink and component interface with isopropyl alcohol prior toassembly or repair.Ensure heat sink is dry before applying TIC 4000.2.Dispense TIC 4000 compound onto the processor or heat sink surface like thermal grease. 3.Assemble the processor and heat sink with clip or constant-pressure fasteners.

TIC

Typical Applications Include:

• High performance computer processors (traditional screw fastening or clamping methods willprovide adequate force to optimize the thermal performance ofTIC 4000)• High watt density applications where the lowest thermal resistance interface is required

Building a Part NumberStandard Options

TIC™: U.S. Patents 6,797,758; 6,624,224; 6,339,120.

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