Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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TIC™ I000A

High Performance,Value Compound for High-End Computer Processors

Features and Benefits

• High thermal performance: 0.32°C/W (@ 50 psi)

• Good screenability

• Room temperature storage

• No post "cure" required

• Exceptional value


TYPICAL PROPERTIES OF TIC I000A
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Gray	Gray	Visual
Density (g/cc)	2.1	2.1	ASTM D792
Continuous Use Temp (°F) / (°C)	302	150	—
ELECTRICAL
Electrical Resistivity (Ohm-meter) (I)	N/A	N/A	ASTM D257
THERMAL
Thermal Conductivity (W/m-K)	1.5	1.5	ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10		25 50	100 200
TO-220 Thermal Performance (°C/W) (2) 0.32		0.32 0.32	0.31 0.28
I) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin
2) TO-220 performance data is provided as a reference to compare material thermal performance

Application Cleanliness

I. Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair Ensure heat sink is dry before applying TIC I000A.

Application Methods

1. Dispense and/or screenprint TIC I000A compound onto the processor or heat sink surface like thermal grease (see a Bergquist Representative for application information).

2. Assemble the processor and heat sink with spring clips or constant-pressure fasteners.

Typical Applications Include:

• High performance CPUs

• High performance GPUs

TIC I000A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high-end computer processor and a heat sink. Other high watt density applications will also benefit from the extremely low thermal impedance of TIC I000A.

TIC I000A compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance.The compound requires pressure of the assembly to cause flow.The TIC I000A compound will resist dripping.

For microprocessor applications, traditional screw fastening or spring clamping methods will provide adequate force to optimize the thermal performance of TIC I000A.

An optimized application would utilize the minimum volume of TIC I000A material necessary to ensure complete wet-out of both mechanical interfaces.

Assembly - No Post Screen Cure

TIC I000A has good screenability No solvent is used to reduce the viscosity, so no post "cure" conditioning is required.

Building a Part Number

Standard Options

H example

TICI000A

25«


< 1	oo I	U 1	Û
on	on	JO	c O	JOj
Sect	Sect	Secti	Secti	Sect

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

Containers: 5cc = 5.0cc, 25cc = 25.0cc, 200cc = 200.0cc, 800cc = 800.0cc, I600cc = I600.0cc

00 = No options

- TICI000A = Thermal Interlace Compound I000A

Note: To build a part number, visit our website at www.bergquistcompany.com.

TIC™: U.S. Patents 6,797,758; 6,624,224; 6,339,120.

BEDDDUI5T

- COM PANY-

Thermal Interface Selection Guide - Bergquist Company - #30

Touch screen, Keyboard, Thermally conductive material, Printed circuit board, Adhesive