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TIC

™

- Thermal Interface Compound

Thermally Conductive Grease Compounds

Bergquist’s line of thermally conductive thermal interface compoundswill flow under assembly pressure to wet-out the thermal interface surfaces and produce very low thermal impedance.TIC products aredesigned for use between a high-end computer processor and a heatsink or other high watt density applications.

Features Benefits Options Applications

The TIC portfolio has diverse thermal and electrical characteristics.Key criteria when selecting TIC products include:• Viscosity• Volume resistivity • Thermal conductivity • Thermal performance • Filler size TIC products are ideal for highwatt density applications.Primary benefits include:• Low interfacial resistance• Low thermal impedance • Resists dripping • Ideally suited to screen printingapplications• No post “cure”conditioningrequired TIC products can be obtained with application-specific options such as:• Containers TIC has a variety of applicationssuch as:• CPU• GPU • IGBT • High power density applications
TIC

Comparison Data and FAQ’s

Q:What is the best fastening method for a TIC interface?A: Q:How should the TIC be applied?A: A constant-pressure fastener is preferred when using TIC for highperformance applications.The constant pressure from a clip or spring washer will ensure adequate pressure is being applied with varying bond line thickness. Q:Will the grease stay in the interface?A: Screenprinting the TIC is a fast,low-cost method that deliversa consistent and accurate amount of material on each application. Alternate methods include stenciling,pin transfer and needle dispensing. All the TIC materials were specifically designed to resist pump-outof the interface,even after many hours of thermal and power cycling. 28