Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Thermally conductive material, Touch screen, Printed circuit board, Membrane keyboard, Adhesive

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Gap Filler 3500S35 (Two-Part)

Thermally Conductive Liquid Gap Filling Material

Features and Benefits

• Thermal Conductivity: 3.6 W/m-K

• Thixotropic nature makes it easy to dispense

• Two-part formulation for easy storage

• Ultra-conforming - designed for fragile and low stress applications

• Ambient or accelerated cure schedules


TYPICAL PROPERTIES OF GAP FILLER 3500S35
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color / Part A	White	White	Visual
Color / Part B	Blue	Blue	Visual
Viscosity as Mixed (cps) (1)	150,000	150,000	ASTM D2I96
Density (g/cc)	1.0	1.0	ASTM D792
Mix Ratio	1:1	1:1	—
Shelf Life @ 25°C (months)	5	5	—
PROPERTY AS CURED
Color	Blue	Blue	Visual
Hardness (Shore 00) (2)	32	32	ASTM D2240
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)	275	275	ASTM DI49
Dielectric Constant (1000 Hz)	8.0	8.0	ASTM DI50
Volume Resistivity (Ohm-meter)	I0⁹	I0⁹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMALAS CURED
Thermal Conductivity (W/m-K)	3.6	3.6	ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3)	60	60	—
Cure @ 25°C (min) (4)	15	15	—
Cure @ I00°C (min) (4)	30	30	—
1) Brooffield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure)

-o

Gap Filler 3500S35 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness.The material is two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity.The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process).The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a low modulus elastomer designed to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface. Gap Filler 3500S35 will lightly adhere to surfaces, thus improving surface area contact. Gap Filler 3500S35 is not designed to be a structural adhesive.

Thickness vs.Thermal Resistance Gap Filler 3500S35

Typical Applications Include:

• Automotive electronics • PCBA to housing

• Discrete components to housing • Fiber optic telecommunications equipment

Configurations Available:

• Supplied in cartridge or kit form

Building a Part Number

4i example

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and

Cartridges: 50cc = 50.0cc,400cc = •tOO.Occ Kits: I200cc= I200.0cc,or I0G= 10 gallon

Pot Life: 60 = 60 minutes

00 = No spacer beads 07 = 0.007" spacer beads

- GF3500S35 = Gap Filler 3500S35 Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

0.20 0.15 0.10 0.05 0.00

0.0

0.5 1.0 1.5 2.0 2.5 Thermal Resistance (C-in²/W)

3.0

BEDDUUI5T

• COM P A N Y •

Thermal Interface Selection Guide - Bergquist Company - #27

Thermally conductive material, Touch screen, Printed circuit board, Membrane keyboard, Adhesive