Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Printed circuit board, Keyboard, Thermally conductive material, Touch screen, Adhesive

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Gap Filler 2000 (Two-Part)

High Thermally Conductive, Liquid Gap Filling Material

Features and Benefits

• Thermal conductivity: 2.0 W/m-K

• Ultra-conforming, designed for fragile and low-stress applications

• Ambient and accelerated cure schedules

• 100% solids - no cure by-products

• Excellent low and high temperature mechanical and chemical stability


TYPICAL PROPERTIES OF GAP FILLER 2000
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color / Part A	Pink	Pink	Visual
Color / Part B	White	White	Visual
Viscosity as Mixed (cps) (1)	300,000	300,000	ASTM D2I96
Density (g/cc)	2.9	2.9	ASTM D792
Mix Ratio	1:1	1:1	—
Shelf Life @ 25°C (months)	6	6	—
PROPERTY AS CURED
Color	Pink	Pink	Visual
Hardness (Shore 00) (2)	70	70	ASTM D2240
Heat Capacity (J/g-K)	1.0	1.0	ASTM EI269
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)	500	500	ASTM DI49
Dielectric Constant (1000 Hz)	7.0	7.0	ASTM DI50
Volume Resistivity (Ohm-meter)	I0¹¹	I0¹¹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMALAS CURED
Thermal Conductivity (W/m-K)	2.0	2.0	ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3)	15	I5	—
Cure @ 25°C (min) (4)	60 - 120	60 - 120	—
Cure @ I00°C (min) (4)	5	5	—
1) Brookfield RV Heli-Path, Spindle TF @ 20 rpm,25°C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure)

Q_ Q_ <

Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and assembly It also eliminates the need for specific pad thickness and die-cut shapes for individual applications.

Gap Filler 2000 is intended for use in thermal interface applications when a strong structural bond is not required. Gap Filler 2000 is formulated for low-modulus,"gel-like" properties.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

• Automotive electronics • Telecommunications

• Computer and peripherals • Thermally conductive vibration dampening

• Between any heat-generating semiconductor and a heat sink

Configurations Available:

• For smaller quantity packaging, please contact Bergquist Sales

Building a Part Number

Standard Options

H example

GF2000

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

Cartridges: 50cc = 50.0cc, 400cc = 400.0cc Kits: I200cc = I200.0cc, or I0G = 10 gallon

Pot Life: 15 = 15 minutes, 60 = 60 minutes

00 = No spacer beads 07 = 0.007" spacer beads

0 Si

cu SI

0 SI

Thickness vs. Thermal Resistance Gap Filler 2000

. 300 - 250 200 150 50 0

- GF2000 = Gap Filler 2000 Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

12 3 4 5 Thermal Resistance (C-in²/W)

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Thermal Interface Selection Guide - Bergquist Company - #26

Printed circuit board, Keyboard, Thermally conductive material, Touch screen, Adhesive