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Gap Filler Gel 1500The first in a new family of highly-conformable gels requiring no curing,mixing or refrigeration Features and BenefitsTYPICAL PROPERTIES OF GAP FILLER GEL 1500 • Highly conformable and requires no curing,mixing or refrigeration• Excellent high and low temperaturemechanical and chemical stability• Storage stability of up to one year withoutfiller settling issues• Reworkable • Good thermal performance:1.4 W/mK • Stress conforming through low modulus Gap Filler Gel 1500 is the first member inBergquist’s new family of pre-cured gap filling materials.The product is a highly conformable gel which requires no curing,mixing or refrig- eration.It’s unique formulation assures excel- lent thermal conductivity,stress conformance through low modulus,excellent high and low temperature chemical storage and storage stability up to one year.Gap Filler Gel 1500 is ideal for thermal interface applications where highly variable gaps and tolerances exist in electronic components,where only minimal stress on components is permissible and re- work may be required.PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Color Gray Gray Visual Shear Modulus(Pa) (1) 1000 - 10,000 1000 - 10,000 ASTM D4473 Viscosity (Pa-sec) (2) 200 200 ASTM D5099 Density (g/cc) 1.8 1.8 ASTM D792 Heat Capacity (J/g-K) 1.3 1.3 ASTM E1269 Continuous Use Temp (°F) / (°C) -76 to 347 -60 to175 _ Shelf Life at 25ºC (months) 12 12 _GAP PAD ELECTRICAL Dielectric Strength (V/mil) 250 250 ASTM D149 Dielectric Constant (1000 Hz) 6 6 ASTM D150 Volume Resistivity (Ohm-meter) 10 11 10 11 ASTM D257 Flame Rating V-O V-O U.L.94 THERMAL Thermal Conductivity (W/m-K) 1.4 1.4 ASTM D5470 1) Parallel plate rheometer at 1 Hz and 0.1% strain.2) Capillary rheometer at 900 sec -1 . Typical Applications Include:• Automotive electronics• Telecommunications• Computer and peripherals• Thermally conductive vibration dampening • Between any heat-generating semiconductor and a heat sinkConfigurations Available:• 30cc,310cc and 600cc tubes • 5-gallon containers • 7 mil spacer beadsBuilding a Part NumberStandard OptionsGap Pad® : U.S. Patent 5,679,457 and others. 25 |