| | | Features and Benefits • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction • Ultra-conforming, designed for fragile and low-stress applications • Ambient and accelerated cure schedules • 100% solids - no cure by-products Gap Filler 1100SF is the thermal solution for silicone-sensitive applications.The material is supplied as a two-part component, curing at room or elevated temperatures.The material exhibits "gel-like" properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of low-stress applications. The two components are colored to assist as a mix indicator (1:1 by volume).The mixed system will cure at ambient temperature. Unlike cured thermal pad materials, the liquid approach offers infinite thickness variations with little or no stress during assembly displacement. Gap Filler 1100SF, although exhibiting some natural tack characteristics, is not intended for use in thermal interface applications requiring a mechanical structural bond. Application Gap Filler 1100SF can be mixed and dispensed using dual-tube cartridge packs with static mixers and manual or pneumatic industrial gun or high volume mixing and dispensing equipment (application of heat may be used to reduce viscosity). | | | | | | | | | | | TYPICAL PROPERTIES OF GAP FILLER II00SF | | | | PROPERTY | IMPERIAL VALUE | METRIC VALUE | TEST METHOD | | | | Color / Part A | Yellow | Yellow | Visual | | | | Color / Part B | Red | Red | Visual | | | | Viscosity as Mixed (cps) (1) | 450,000 | 450,000 | ASTM D2I96 | | | | Density (g/cc) | 2.0 | 2.0 | ASTM D792 | | | | Mix Ratio | 1:1 | 1:1 | — | | | | Shelf Life @ 25°C (months) | 6 | 6 | — | | | | PROPERTY AS CURED | | | | Color | Orange | Orange | Visual | | | | Hardness (Shore 00) (2) | 60 | 60 | ASTM D2240 | | | | Heat Capacity (J/g-K) | 0.9 | 0.9 | ASTM EI269 | | | | Continuous Use Temp (°F) / (°C) | -76 to 257 | -60 to 125 | — | | | | ELECTRICAL AS CURED | | | | Dielectric Strength (V/mil) | 400 | 400 | ASTM DI49 | | | | Dielectric Constant (1000 Hz) | 5.0 | 5.0 | ASTM DI50 | | | | Volume Resistivity (Ohm-meter) | I010 | I010 | ASTM D257 | | | | Flame Rating | V-O | V-O | U.L. 94 | | | | THERMALAS CURED | | | | Thermal Conductivity (W/m-K) | I.I | I.I | ASTM D5470 | | | | CURE SCHEDULE | | | | Pot Life @ 25°C (min) (3) | 10-15 | I0-I5 | — | | | | Cure @ 25°C (hrs) (4) | 4 | 4 | — | | | | Cure @ I00°C (min) (4) | 45 | 45 | — | | | | 1) Brookfield RV Heli-Path, Spindle TF @ 2 rpm,25°C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure) | | | | | | | | | | | |
| | | Typical Applications Include: • Silicone-sensitive optic components • Hard disk assemblies • Silicone-sensitive electronics • Dielectric for bare-leaded devices • Filling various gaps between heat-generating devices to heat industrial sinks and housings • Mechanical switching relay Configurations Available: • Supplied in cartridge or kit form | | |
| | | NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 400cc = 400.0cc Kits: I200cc = I200.0cc, or I0G = 10 gallon Pot Life: 15 = 15 minutes 00 = No spacer beads 07 = 0.007" spacer beads | | |
| | | Example - Viscosity of Part A @ 45°: Viscosity of Part A at 25°C is 450,000 cp. The multiplication factor for part A at 45°C is 0.39. Therefore: (450,000) x (0.39) = 175,500 cps | | |
| | | - GFII00SF = Gap Filler II00SF Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad®: U.S. Patent 5,679,457 and others. | | |