Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Keyboard, Printed circuit board, Membrane keyboard, Touch screen, Thermally conductive material

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Gap Pad® 5000S35

High thermal conductivity plus "S-Class" softness and conformability

Features and Benefits

• High thermal conductivity: 5 W/m-K

• Highly conformable,"S-Class" softness

• Natural inherent tack reduces interfacial thermal resistance

• Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads

• Fiberglass reinforced for puncture, shear and tear resistance

• Excellent thermal performance at low pressures

TYPICAL PROPERTIES OF GAP PAD 5000S35


PROPERTY	IMPERIAL VALUE		METRIC VALUE		TEST METHOD
Color	Light Green		Light Green		Visual
Reinforcement Carrier	Fiberglass		Fiberglass		—
Thickness (inch) / (mm)	0.02 to 0.125		0.508 to 3.175		ASTM D374
Inherent Surface Tack (lor 2 sided)	2		2		—
Density (g/cc)	3.6		3.6		ASTM D792
Heat Capacity (J/g-K)	1.0		1.0		ASTM C35I
Hardness Bulk Rubber (Shore 00) (1)	35		35		ASTM D2240
Young's Modulus (psi) / (kPa) (2)	17.5		121		ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392		-60 to 200		—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>5000		>5000		ASTM DI49
Dielectric Constant (1000 Hz)	7.5		7.5		ASTM DI50
Volume Resistivity (Ohm-meter)	I0⁹		I0⁹		ASTM D257
Flame Rating	V-O		V-O		U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	5.0 5.0 ASTM D5470
THERMAL PERFORMANCE vs. PRESSURE
Pressure (psi)		10	25	50	100	200
TO-220 Thermal Performance (°C/W) (20 mil)		1.18	1.10	0.99	0.84	0.72
Thermal Impedance (°C-in²/W) (3)		0.21	0.18	0.15	0.14	0.12
TO-220 Thermal Performance (°C/W) (40 mil)		1.54	1.34	1.15	1.00	0.90
Thermal Impedance (°C-in²/W) (3)		0.30	0.28	0.25	0.22	0.13
1) One second delay value Shore 00 hardness scale. 2) Young's Modulus.calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more information on Gap Pad modulus.refer to Bergquist Application Note #116.3) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness,flatness and pressure applied.

Q_ Q_

Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity The material yields extremely soft characteristics while maintaining elasticity and conformabilityThe fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance.The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. Gap Pad 5000S35 is ideal for high-performance applications at low mounting pressures.

Thickness vs.Thermal Resistance Gap Pad 5000S3S

Typical Applications

• Memory packages / modules

• PC Board to chassis

• ASICs and DSPs

• CDROM / DVD ROM

• Voltage Regulator Modules ( VRMs) and POLs

• Thermally-enhanced BGAs

Configurations Available:

• Die-cut parts are available in any shape or size, separated or in sheet form

• Standard material thicknesses of 20,40, 60, 80, 100 and 125 mil

• Custom thicknesses available upon request

Building a Part Number

Standard Options

« example

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

0816 = Standard sheet size 8" x 16", or 00 = custom configuration

02 = Natural tack, both sides

Standard thicknesses available: 0.020", 0.040", 0.060" 0.080", 0.100", 0.125"

GP5000S35

0.020 -_02

U с О

-_08I6

□ с О

'ti

0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10

Thermal Resistance (°C-in²/W)

Note: Resultant thickness is defined as the final gap thickness of the application.

- GP5O0OS35 = Gap Pad 5000S35 Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

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Thermal Interface Selection Guide - Bergquist Company - #22

Keyboard, Printed circuit board, Membrane keyboard, Touch screen, Thermally conductive material