Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Adhesive, Thermally conductive material, Printed circuit board, Membrane keyboard, Touch screen

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Gap Pad® A3000

Thermally Conductive, Reinforced Gap Filling Material

Features and Benefits

• Thermal conductivity: 2.6 W/m-K

• Fiberglass reinforced for puncture, shear and tear resistance

• Reduced tack on one side to aid in application assembly

• Electrically isolating


TYPICAL PROPERTIES OF GAP PAD A3000
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Gold	Gold	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (inch) / (mm)	0.015 to 0.125	0.381 to 3.175	ASTM D374
Inherent Surface Tack (1- or 2-sided)	1 1
Density (g/cc)	3.2	3.2	ASTM D792
Heat Capacity (J/g-K)	1.0	1.0	ASTM EI269
Hardness, Bulk Rubber (Shore 00) (1)	80	80	ASTM D2240
Young's Modulus (psi) / (kPa) (2)	50	344	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>5000	>5000	ASTM DI49
Dielectric Constant (1000 Hz)	7.0	7.0	ASTM DI50
Volume Resistivity (Ohm-meter)	I0¹⁰	I0¹⁰	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	2.6	2.6	ASTM D5470
1) Thirty second delay value Shore 00 hardness scale 2) Young's Modulus,calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more modulus,refer to Bergquist Application Note #116			information on Gap Pad

Q_ Q_

Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in burn-in and rework processes while the light gold and soft side of the material allows for added compliance.

Note: Resultant thickness is defined as the final gap thickness of the application.

Thickness vs. Thermal Resistance Gap Pad A3000

_ 125 f 115 £ 105 ts 95

J ⁸⁵h 65 £ 55 I 45 3 35 _& 25

0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70 Thermal Resistance (C-in²/W)

Typical Applications Include:

• Computer and peripherals • Telecommunications

• Heat pipe assemblies • RDRAM™ memory modules

• CDROM / DVD cooling • Between CPU and heat spreader

• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader

Configurations Available:

• Sheet form, die-cut parts and roll form (converted or unconverted)

ling a Part Num

Standard Options

H exampie

GPA3000

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

0816 = Standard sheet size 8" x 16", or

00 = custom configuration

01 = Natural tack, one side

Standard thicknesses available: 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"

CU SI

О си

- GPA3000 = Gap Pad A3000 Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

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Thermal Interface Selection Guide - Bergquist Company - #20

Adhesive, Thermally conductive material, Printed circuit board, Membrane keyboard, Touch screen