Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Thermally conductive material, Keyboard, Printed circuit board, Touch screen, Membrane keyboard

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Gap Pad® 2500

Thermally Conductive, Unreinforced Gap Filling Material

Features and Benefits

• Thermal conductivity: 2.7 W/m-K

• High thermal performance, cost-effective solution

• Unreinforced construction for additional compliancy

• Medium compliancy and conformability


TYPICAL PROPERTIES OF GAP PAD 2500
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Light Brown	Light Brown	Visual
Reinforcement Carrier	—	—	—
Thickness (inch) / (mm)	0.020 to 0.125	0.508 to 3.175	ASTM D374
Inherent Surface Tack (1- or 2-sided)	2	2	—
Density (g/cc)	3.1	3.1	ASTM D792
Heat Capacity (J/g-K)	1.0	1.0	ASTM EI269
Hardness, Bulk Rubber (Shore 00) (1)	80	80	ASTM D2240
Young's Modulus (psi) / (kPa) (2)	113	779	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>6000	>6000	ASTM DI49
Dielectric Constant (1000 Hz)	6.8	6.8	ASTM DI50
Volume Resistivity (Ohm-meter)	10¹¹	10¹¹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	2.7	2.7	ASTM D5470
1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus.calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more information on Gap Pad modulus.refer to Bergquist Application Note #116.

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Gap Pad 2500 is a thermally conductive, electrically insulating, unreinforced gap filling material. Gap Pad 2500 is a filled-polymer material yielding an elastic polymer that allows for easy handling and converting without the need for reinforcementThese properties also allow for good wet-out and interfacing characteristics to surfaces with roughness and/or topography All these characteristics make this material ideal for applications using either clip or screw-mounted assemblies.

Gap Pad 2500 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly The material is supplied with protective liners on both sides.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

• Multiple heat-generating components to a common heat sink

• Graphics chips to heat sinks

• Processors to heat sinks

• Mass storage drives

• Wireline / wireless communications hardware

Configurations Available:

• Sheet form and die-cut parts

Building a Part Number

Standard Options

Ü example

GP2500

0.100 - 02

ACME 89302 Rev a

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

0816 = Standard sheet size 8" x 16", or 00 = custom configuration

02 = Natural tack, both sides

Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"

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Thickness vs. Thermal Resistance Gap Pad 2500

120 100 80 60 40

20 0

- GP2500 = Gap Pad 2500 Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

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0.20 0.60 1.00 1.40 1.80 Thermal Resistance (C-in²/W)

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Thermal Interface Selection Guide - Bergquist Company - #19

Thermally conductive material, Keyboard, Printed circuit board, Touch screen, Membrane keyboard