Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Thermally conductive material, Membrane keyboard, Keyboard, Printed circuit board, Touch screen

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Gap Pad® 2500S20

Highly Conformable,Thermally Conductive, Reinforced "S-Class" Gap Filling Material

Features and Benefits

• Thermal conductivity: 2.4 W/m-K

• Low "S-Class" thermal resistance at ultra-low pressures

• Ultra conformable, "gel-like" modulus

• Designed for low-stress applications


TYPICAL PROPERTIES OF GAP PAD 2500S20
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Light Yellow	Light Yellow	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (inch) / (mm)	0.010 to 0.125	0.254 to 3.175	ASTM D374
Inherent Surface Tack (1- or 2-sided)	2	2	—
Density (g/cc)	3.1	3.1	ASTM D792
Heat Capacity (J/g-K)	1.0	1.0	ASTM EI269
Hardness, Bulk Rubber (Shore 00) (1)	20	20	ASTM D2240
Young's Modulus (psi) / (kPa) (2)	5	35	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>3000	>3000	ASTM DI49
Dielectric Constant (1000 Hz)	6.6	6.6	ASTM DI50
Volume Resistivity (Ohm-meter)	10¹¹	10¹¹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	2.4	2.4	ASTM D5470
1) Thirty second delay value Shore 00 hardness scale 2) Young's Modulus,calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more modulus,refer to Bergquist Application Note #116			information on Gap Pad

Fiberglass reinforced for puncture, shear and tear resistance

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Typical Applications

• Between processors and heat sinks

• Between graphics chips and heat sinks

• DVD and CDROM electronics cooling

• Areas where heat needs to be transferred to a frame, chassis or other type of heat spreader

Configurations Available:

• Sheet form and die-cut parts

Gap Pad 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K.The material is a filled-polymer material yielding extremely soft, elastic characteristics.The material is reinforced to provide easy handling, converting, added electrical isolation and tear resistance. Gap Pad 2500S20 is well suited for low-pressure applications that typically use fixed standoff or clip mounting.The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

Gap Pad 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly The material is supplied with protective liners on both sides.

Note: Resultant thickness is defined as the final gap thickness of the application.

Building a Part Number

Standard Options

Ü example

GP2500S20

ACME 89302 Rev a

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

0816 = Standard sheet size 8" x 16", or 00 = custom configuration

02 = Natural tack, both sides

Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"

- GP2500S20 = Gap Pad 2500S20 Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

Thickness vs. Thermal Resistance Gap Pad 2500S20

130 110 90 70 50

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0.43 0.68 0.93 1.18 1.43 1.68 1.93 Thermal Resistance (C-in²/W)

0.18

2.18

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Thermal Interface Selection Guide - Bergquist Company - #18

Thermally conductive material, Membrane keyboard, Keyboard, Printed circuit board, Touch screen