Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Printed circuit board, Touch screen, Thermally conductive material, Membrane keyboard, Adhesive

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Gap Pad® 2000S40

Highly Conformable,Thermally Conductive, Reinforced "S-Class" Gap Filling Material

Features and Benefits

• Thermal conductivity: 2.0 W/m-K

• Low "S-Class" thermal resistance at very low pressures

• Highly conformable, low hardness

• Designed for low-stress applications

• Fiberglass reinforced for puncture, shear and tear resistance


TYPICAL PROPERTIES OF GAP PAD 2000S40
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Gray	Gray	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (inch) / (mm)	0.020 to 0.125	0.508 to 3.175	ASTM D374
Inherent Surface Tack (1- or 2-sided)	2	2	—
Density (g/cc)	2.9	2.9	ASTM D792
Heat Capacity (J/g-K)	0.6	0.6	ASTM EI269
Hardness, Bulk Rubber (Shore 00) (1)	30	30	ASTM D2240
Young's Modulus (psi) / (kPa) (2)	45	310	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>5000	>5000	ASTM DI49
Dielectric Constant (1000 Hz)	6.0	6.0	ASTM DI50
Volume Resistivity (Ohm-meter)	I0¹¹	I0¹¹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	2.0	2.0	ASTM D5470
1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus.calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more information on Gap Pad modulus.refer to Bergquist Application Note #116.

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Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material.The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.

Gap Pad 2000S40 is electrically isolating, and well suited for applications requiring electrical isolation between heat sinks and high-voltage, bare-leaded devices. Gap Pad 2000S40 is a filled, thermally conductive polymer reinforced with a fiberglass carrier on one side, allowing for easy material handling and enhanced puncture, shear and tear resistance.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

• Power electronics DC/DC; 1/4, 1/2, full bricks, etc.

• Mass storage devices

• Graphics card/processor/ASIC

• Wireline/wireless communications hardware

• Automotive engine/transmission controls

Configurations Available:

• Sheet form and die-cut parts

Standard Options

4i example

ildmg a Par

GP2000S40

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

0816 = Standard sheet size 8" x 16", or 00 = custom configuration

02 = Natural tack, both sides

Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"

cu Si

Thickness vs. Thermal Resistance Gap Pad 2000S40

125 100 75 50 25 0

- GP2000S40 = Gap Pad 2000S40 Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

0.50 1.00 1.50 2.00 Thermal Resistance (C-in²/W)

2.50

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Thermal Interface Selection Guide - Bergquist Company - #17

Printed circuit board, Touch screen, Thermally conductive material, Membrane keyboard, Adhesive