Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Touch screen, Thermally conductive material, Adhesive, Printed circuit board, Membrane keyboard

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Gap Pad® A2000

High Performance.Thermally Conductive Gap Filling Material

Features and Benefits

• Thermal conductivity: 2.0 W/m-K

• Fiberglass reinforced for puncture, shear and tear resistance

• Electrically isolating


TYPICAL PROPERTIES OF GAP PAD A2000
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Gray	Gray	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (inch) / (mm)	0.010 to 0.040	0.254 to 1.016	ASTM D374
Inherent Surface Tack (1- or 2-sided)	2	2	—
Density (g/cc)	2.9	2.9	ASTM D792
Heat Capacity (J/g-K)	1.0	1.0	ASTM EI269
Hardness, Bulk Rubber (Shore 00) (1)	80	80	ASTM D2240
Youngs Modulus (psi) / (kPa) (2)	55	379	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>4000	>4000	ASTM DI49
Dielectric Constant (1000 Hz)	6.0	6.0	ASTM DI50
Volume Resistivity (Ohm-meter)	10¹¹	10¹¹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	2.0	2.0	ASTM D5470
1) Thirty second delay value Shore 00 hardness scale 2) Young's Modulus.calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more modulus.refer to Bergquist Application Note #116			information on Gap Pad

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Gap Pad A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components.The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

• Computer and peripherals; between CPU and heat spreader

• Telecommunications

• Heat pipe assemblies

• RDRAM™ memory modules

• CDROM / DVD cooling

• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader

• DDR SDRAM memory modules

Configurations Available:

• Sheet form, die-cut parts and roll form (converted or unconverted)

Building a Part Number Standard Options

GPA2000 - 0.010 - 02 - 0816 -_NA H example

NA = Selected standard option. If not selecting a standard

- option, insert company name, drawing number, and

revision level.

Thickness vs. Thermal Resistance Gap Pad A2000

I a!

0.20 0.30 0.40 0.50 0.60 0.70 Thermal Resistance (C-in²/W)

0.80

0816 = Standard sheet size 8" x 16", or 00 = custom configuration

02 = Natural tack, both sides

Standard thicknesses available: 0.010", 0.015", 0.020" 0.040"

- GPA2000 = Gap Pad A2000 Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

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Thermal Interface Selection Guide - Bergquist Company - #16

Touch screen, Thermally conductive material, Adhesive, Printed circuit board, Membrane keyboard