Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Adhesive, Thermally conductive material, Touch screen, Keyboard, Membrane keyboard

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Gap Pad® 1500R

Thermally Conductive, Reinforced Gap Filling Material

Features and Benefits

• Thermal conductivity: 1.5 W/m-K

• Fiberglass reinforced for puncture, shear and tear resistance

• Easy release construction

• Electrically isolating


TYPICAL PROPERTIES OF GAP PAD 1500R
PROPERTY	IMPERIAL VALUE	METRIC VALUE TEST METHOD
Color	Black	Black	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (inch) / (mm)	0.010 to 0.020	0.254 to 0.508	ASTM D374
Inherent Surface Tack (1- or 2-sided)	2	2	—
Density (g/cc)	2.1	2.1	ASTM D792
Heat Capacity (J/g-K)	1.3	1.3	ASTM EI269
Hardness, Bulk Rubber (Shore 00) (1)	40	40	ASTM D2240
Young's Modulus (psi) / (kPa) (2)	45	310	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>6000	>6000	ASTM DI49
Dielectric Constant (1000 Hz)	6.0	6.0	ASTM DI50
Volume Resistivity (Ohm-meter)	I0¹¹	I0¹¹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	1.5	I.5	ASTM D5470
1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus.calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more information on Gap Pad modulus.refer to Bergquist Application Note #116.

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Gap Pad I500R has the same highly conformable, low-modulus polymer as the standard Gap Pad I500.The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance.The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

• Telecommunications

• Computer and peripherals

• Power conversion

• RDRAM™ memory modules / chip scale packages

• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader

Configurations Available:

• Sheet form, die-cut parts, and roll form (converted or unconverted)

Thickness vs. Thermal Resistance Gap Pad I500R

Building a Part Number

Standard Options

ACMEI0256 Rev. A a example

0.020 - 02

GPI500R

I a!

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

0816 = Standard sheet size 8" x 16", or 00 = custom configuration

02 = Natural tack, both sides

0 cu

0.25 0.30 0.35 0.40 0.45 0.50 Thermal Resistance (C-in²/W)

0.55

Standard thicknesses available: 0.010", 0.015", 0.020"

- GPI500R = Gap Pad I500R Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

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Thermal Interface Selection Guide - Bergquist Company - #15

Adhesive, Thermally conductive material, Touch screen, Keyboard, Membrane keyboard