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| | | Gap Pad® 1000SF | | |
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| | | Thermally Conductive, Silicone-Free Gap Filling Material
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| | | Features and Benefits • Thermal conductivity: 0.9 W/m-K • No silicone outgassing • No silicone extraction • Reduced tack on one side to aid in application assembly | | | | | | | | | | | TYPICAL PROPERTIES OF GAP PAD 1000SF | | | | PROPERTY | IMPERIAL VALUE | METRIC VALUE | TEST METHOD | | | | Color | Green | Green | Visual | | | | Reinforcement Carrier | Fiberglass | Fiberglass | — | | | | Thickness (inch) / (mm) | 0.010 to 0.125 | 0.254 to 3.175 | ASTM D374 | | | | Inherent Surface Tack (1- or 2-sided) | 2 | 2 | — | | | | Density (g/cc) | 2.0 | 2.0 | ASTM D792 | | | | Heat Capacity (J/g-K) | 1.1 | I.I | ASTM EI269 | | | | Hardness, Bulk Rubber (Shore 00) (1) | 40 | 40 | ASTM D2240 | | | | Young's Modulus (psi) / (kPa) (2) | 34 | 234 | ASTM D575 | | | | Continuous Use Temp (°F) / (°C) | -76 to 257 | -60 to 125 | — | | | | ELECTRICAL | | | | Dielectric Breakdown Voltage (Vac) | >6000 | >6000 | ASTM DI49 | | | | Dielectric Constant (1000 Hz) | 5.0 | 5.0 | ASTM DI50 | | | | Volume Resistivity (Ohm-meter) | I010 | I010 | ASTM D257 | | | | Flame Rating | V-1 | V-I | U.L. 94 | | | | THERMAL | | | | Thermal Conductivity (W/m-K) | 0.9 | 0.9 | ASTM D5470 | | | | 1) Thirty second delay value Shore 00 hardness scale 2) Young's Modulus.calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch2. For more modulus.refer to Bergquist Application Note #116 | information on Gap Pad | | | | | | | | | | | |
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| | | The new Gap Pad I000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications.The material is ideal for applications with high standoff and flatness tolerances. Gap Pad I000SF is reinforced for easy material handling and added durability during assembly The material is available with a protective liner on both sides of the material. Note: Resultant thickness is defined as the final gap thickness of the application. | | |
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| | | Typical Applications Include: • Digital disk drives / CD-ROM • Automotive modules • Fiber optics modules Configurations Available: • Sheet form • Die-cut parts Building a Part Number | | |
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| | | Thickness vs. Thermal Resistance Gap Pad I000SF | | |
| | | Standard Options H example NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0806: = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Standard thicknesses available: 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" | | |
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| | | GPI000SF | | |
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| | | 12 3 4 Thermal Resistance (C-in2/W) | | |
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| | | - GPI000SF = Gap Pad I000SF Material Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad®: U.S. Patent 5,679,457 and others. | | |
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