Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Membrane keyboard, Keyboard, Thermally conductive material, Printed circuit board, Adhesive

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Gap Pad VO Soft®

Highly Conformable,Thermally Conductive Material for Filling Air Gaps

Features and Benefits

• Thermal conductivity: 0.8 W/m-K

• Conformable, low hardness

• Enhanced puncture, shear and tear resistance

• Electrically isolating


TYPICAL PROPERTIES OF GAP PAD VO SOFT
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Mauve/Pink	Mauve/Pink	Visual
Reinforcement Carrier	Sil-Pad	Sil-Pad	—
Thickness (inch) / (mm)	0.020 to 0.200	0.508 to 5.080	ASTM D374
Inherent Surface Tack (1- or 2-sided)	1 1
Density (g/cc)	1.6	I.6	ASTM D792
Heat Capacity (J/g-K)	1.0	1.0	ASTM EI269
Hardness, Bulk Rubber (Shore 00) (1)	25	25	ASTM D2240
Young's Modulus (psi) / (kPa) (2)	40	275	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>6000	>6000	ASTM DI49
Dielectric Constant (1000 Hz)	5.5	5.5	ASTM DI50
Volume Resistivity (Ohm-meter)	I0¹¹	I0¹¹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	0.8	0.8	ASTM D5470
1) Thirty second delay value Shore 00 hardness scale 2) Young's Modulus.calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more modulus.refer to Bergquist Application Note #116			information on Gap Pad

Q_ Q_

Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low-modulus, filled-silicone polymer on a rubber-coated fiberglass carrier The material can be used as an interface where one side is in contact with a leaded device.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

• Telecommunications

• Computer and peripherals

• Power conversion

• Between heat-generating semiconductors or magnetic components and a heat sink

• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader

Configurations Available:

• Sheet form and die-cut parts

Thickness vs. Thermal Resistance Gap Pad VO Soft

~ 200 I 180 r 160 « 140 -S 120 É 100 S 80 -§ 60 J 40 20

Building a Part Number

Standard Options

M example

GPVOS

ACMEI0256 Rev. a

2 3 4 5 6 7

Thermal Resistance (C-in²/W)

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

0816 = Standard sheet size 8" x 16", or 00 = custom configuration

AC = Pressure sensitive adhesive, one side 00 = No pressure sensitive adhesive

Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200"

cu Si

o cu

- GPVOS = Gap Pad VO Soft Material

Note: To build a part number, visit our website at www.bergquistcompany.com.

Gap Pad®: U.S. Patent 5,679,457 and others.

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Thermal Interface Selection Guide - Bergquist Company - #10

Membrane keyboard, Keyboard, Thermally conductive material, Printed circuit board, Adhesive