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Dielectric Materials Higher Power Applications Lower Power Applications
Low ThermalImpedance HighTemperature LTIHT CMLCircuit Material LaminateMPMulti-Purpose
Thermal Models The following photos are thermal models, which depict heat spreading and thermal transfer capability of each dielectric family. LTI - Low Thermal Impedanceand HT - High TemperatureMP - Multi-PurposeCML - Circuit Material Laminate 7