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Thermal Clad Applications

Power Conversion Heat-Rail and Forming LEDs

Due to the size constraints and watt-density requirements in DC-DC conversion, Thermal Clad has become the favored choice. Thermal Clad offers a variety of thermal performances,is compatible with mechanicalfasteners and is highly reliable. It can be used in almost every form-factor and fabri- cated in a wide variety of substrate metals, thicknesses and copper foil weights.(Note: In some power conversion applications,the base layer of metal may not be needed. Refer to page 10 of this guide). The use of Thermal Clad in heat-railapplicationshas grown significantly and iscurrently used in automotive, audio, motorcontrol and power conversion applications. Utilizing the many advantages of surface mount assembly, attachment capabilities and high thermal performance, Thermal Clad offers a cost effective solution for heat man- agement. When using Thermal Clad as the metal base substrate, the assembly process can be fully automated, thus eliminating the high labor cost of hand assembly. In high-brightness LED applications, lightoutput and long life are directly attributable to how well the LED’s are managed thermally. Thermal Clad is an excellent solution for designers. Because T-Clad is a metal based material, it can be configured for special shapes, bends, and thicknesses thus allowing the designer to put high-brightness LED lampsin virtually any application. Mountinghigh-brightness LED’s on T-Clad assures the lowest possible operating temperatures and maximum brightness, color and life.

Motor Drives Solid State Relays

Compact high reliability motor drivesbuilt on Thermal Clad have set the bench- mark for watt-density. Dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements. With the ability to fabri-cate in a wide variety of form-factors, theimplementation into either compact or inte- grated motors drives is realized. The avail- ability of Thermal Clad HTmakes high tem- perature operation possible. The implementation of Solid State Relaysin many control applications calls for very thermally efficient, and mechanically robust substrates. Thermal Clad offers both. The material construction allows mounting configurationsnot reasonably possible withceramic substrates. New dielectrics meet the high thermal performance expectations and can even out-perform existing ceramic based designs.

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