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â–¼ Thermal Clad

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Overview

Key Benefits Of Thermal Clad

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The Bergquist Company is the world leader in the developmentand manufacture of thermally conductive interface materials. Thermal Clad Insulated Metal Substrate (IMS

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) was developed byBergquist as a thermal management solution for today’s higher watt- density surface mount applications where heat issues are a major concern.Thermal Clad substrates minimize thermal impedance andconductheat more effectively and efficiently than standard printedwiring boards (PWB's). These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications.Thermal Clad is a cost effective solution which can eliminatecomponents, allow more simplified designs, smaller devices and overall less complicated production processes. Additional benefitsof Thermal Clad include lower operating temperatures, longercomponent life, and better durability.Bergquist Thermal Clad substrates are not limited to use withmetal base layers. In one example, power conversion applications can enhance their performance by replacing FR-4 with Thermal Clad dielectrics in multi-layer assemblies. In this application, the thickness of the copper circuit layer can be minimized by the high thermal performance of Thermal Clad. (Note: For additional information on this topic, refer to the "specialty section" on pages 10-11 of this guide).

Thermal Clad is a versatile substrate. In this motor control application, the dielectric hasbeen selectively removed and the metal has been formed with three-dimensional features. Motor control Thermal Clad after power and control devices are mounted. The heatspreading capability has optimized the design, eliminating the need for additional heat sinks.

Thermal Clad is a complete thermal management system, unlikethe traditional technology which uses heat sinks, clips and other mounting hardware. Thermal Clad enables low-cost production by eliminating the need for costly manual assembly.

Traditionally, cooling an FR-4 boardrequired the use of a large heat sink,interface material and various hard- ware (brackets, screws or clamps). This configuration requires manual assembly which is labor intensive. Conventional methodsmeasured junction temperature Cooling with Thermal Clad caneliminate the need for heat sinks, device clips, cooling fans and other hardware. An automated assembly method will reduce long term costs.

Thermal Clad Benefits Include:

• Lower operating temperature• Reduce printed circuit board size • Increase power density • Extend the life of dies • Reduce the number of interconnects • Improve product thermal and mechanical performance • Combine power and control • Improve product durability • Enable better use of surface mount technology • Reduce heat sinks and other mounting hardware, includingthermal interface material• Replace fragile ceramic substrates with greatermechanical durability

Thermal Cladmeasured junction temperature 5W=Tj 43ºC 5W=Tj 35ºC

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