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Thermal Clad Configurations

Custom Circuit Sheet And Roll Format

Bergquist Thermal Clad substrates are custom configured to yourdesign parameters at our Prescott,Wisconsin facility. Our field application support personnel in conjunction with our mechanical and process engineers are are available to assist you in taking your design from paper to finished product. Engineering is available for the following construction parameters and options.• Artwork layout recommendations• Base metal requirements and mechanical configuration • Dielectric thickness • Copper weights (1-10 oz.) • Solder mask layouts • Organic protective coatings • Hot air solder level • Special plating options • Tooling/singulation options CML (Circuit Material Laminate) is a ceramic filled polymer thatforms a strong, thermally conductive bond to metal heat spreaders and is an excellent alternative to pre-preg.• 24" (61 cm) Roll Standard (custom sizes are available) • Maximum roll length of 2000' (609.6 meters) • Sheets 16"x19" (41 cm x 48 cm) and 18"x 24" (46 cm x 61 cm)

UL Certifications Directory

For information regarding the UL recognition status of BergquistThermal Clad materials and “Prescott Operations” circuit fabrication, the UL website provides the latest information.Using the address: http//www.ul.com select; OnlineCertifications Directory. Enter one of the following file numbers: UL File Number, to the applicable Bergquist file.

QMTS2.E121882

Panel Form

Polymeric Materials - Filament-wound tubing, IndustrialLaminates, Vulcanized Fiber, and Materials for Use in Fabricating Recognized Printed Wiring Boards - Components. • 16" x 19" (41 cm x 48 cm)and 18" x 24" (46 cm x 61 cm) • Base plate metals • Aluminum 6061-T6, 5052-H34, standardsfrom 0.020" to 0.125" (0.5mm to 3.2mm)• Copper 110 Half-Hard and Full-Hard, standardsfrom 0.020" to 0.125" (0.5mm to 3.2mm)• Foil Thickness: 1-10oz.

ZPMV2.E122713

Wiring, Printed - Component •In each group there is Guide Information which will give afurther description of the categories listed.•In each group the recognized materials or fabricated circuitboard types will be listed.