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Where Thermal Solutions All Come Together

Bond-Ply

® The Bond-Ply family of materials are thermally conductive and electrically isolating.Bond-Ply is available in a PSAor laminating format, is reinforced with fiberglass or film and comes in a variety of different thicknesses. Bond-Ply provides for the mechanical decoupling of bonded materials with mismatched thermal coefficients of expansion, typical applications include:• Bonding bus bars in a variety of electronic modules and sub assemblies• Attaching a metal-based component to a heatsink • Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages • Bonding flexible circuits to a rigid heat spreader or thermal plane • Assembly tapes for BGAheat spreader

Gap Pad

® The Gap Pad product family offers a line of thermally conductive materials whichare highly conformable. Varying degrees of thermal conductivities and compression deflection characteristics are available. Typical applications include:• On top of a semiconductor package such as a QFPor BGA. Often times,several packages with varying heights can use a common heat sink when utilizing Gap Pad• Between a PCB or substrate and a chassis, frame, or other heat spreader • Areas where heat needs to be transferred to any type of heat spreaderGap Pads are available in thickness of 0.010" to 0.200", and in custom shapes,with or without adhesive.
HeatSpreader Gap PadPowerDevice FR-4 Board Lower Power Applicationwith Gap Pad

Top Efficiency InThermal Materials For Today's Changing Technology.

Contact Bergquist for additional informationregarding our Thermal Solutions. We are constantly innovating to offer you the greatest selection of options and flexibility to meet today's changing technology. 23