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Additional Bergquist Solutions forSurface-Mount Applications

Hi-Flow

¤ The Hi-Flow family of phase change materials offers an easy to apply thermalinterface for many surface mount packages. At the phase change temperature, Hi-Flow materials change from a solid and flow with minimal applied pressure. This characteristic optimizes heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to replace messy thermal grease.Bergquist phase change materials are specially compounded to prevent pump outof the interface area, which is often associated with thermal grease.
Power Device Thermal Clad Hi-Flow HeatSpreader High Power Application Hi-Flow with Thermal Clad
Heat Spreader Processor Hi-Flow FR-4 Board High Power Application Hi-Flow without Thermal Clad

Typical applications include:

• Pentium
® , Athlon
® , and Other High Performance CPUs • DC/DC Converters • Power ModulesHi-Flow materials are manufactured with or without film or foil carriers.Custom shapes and sizes for non-standard applications are also available.

Sil-Pad

¤ Sil-Pad is the benchmark in thermal interface materials. The Sil-Pad familyof materials are thermally conductive and electrically insulating. Available in custom shapes, sheets, and rolls, Sil-Pad materials come in a variety of different thicknesses and are frequently used in SMTapplications such as:• Interface between thermal vias in a PCB, and a heat sink or casting• Heat sink interface to many surface mount packages
Power Device Sil-Pad orBond-Ply FR-4 Heat Spreader Mid Power Application with Bond-Ply 22