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| | | Design Considerations When Selecting the Base Metal Layer | | |
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| | | ▼ Coefficient Of Thermal Expansion And Heat Spreading ▼ Coefficient Of Thermal Expansion And Solder Joints | | ▼ Strength, Rigidity And Weight ▼ Electrical Connections To Base Layer ▼ Surface Finish ▼ Costs | | |
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| | | | | | | | | | | | | | r | THERMAL | COEFFICIENT OF | | MODULUS OF | | | | | | CONDUCTIVITY | THERMAL EXPANSION | DENSITY | RIGIDITY | YIELD STRENGTH | | | | METAL / ALLOY | [W/mK] | [ppm/K] | [g/cc] | [GPa] | [MPa] | | | | Copper | 400 | 17 | 8.9 | 44.1 | 310 | | | | Aluminum 5052 | 150 | 25 | 2.7 | 25.9 | 215 | | | | Aluminum 6061 | 150 | 25 | 2.7 | 26 | 230 | | | | 304 Stainless Steel | 16 | 16 | 7.9 | 200 | 824 | | | | Cold Rolled Steel | 50 | 13 | 7.9 | 200 | 330 | | | | 20% AlSiC | 175 | 15 | 2.8 | 110 | 414 | | | | 30% AlSiC | 200 | 12 | 2.9 | 138 | 418 | | | | | | | | | | | | | |
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| | | 27% AlSi 177 16 2.7 80 210 | | |
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| | | Coefficient ofThermal Expansion and Heat Spreading | | |
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| | | The adjacent graph depicts the CTE of the base material in relationship to the heat spreading capability of the metal. Although Aluminum and Copper are the most popular base layers used in Thermal Clad other metals and composites have been used in applications where CTE mismatch is a factor. The adjacent table represents standard and non-standard base layers. | | |
| | | Base Layer Selection Considerations | | |
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| | | 400 350 300 250 200 150 100 50 0 | | |
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| | | CTE Thermal Conductivity | | |
| | | £20 | | |
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| | | V | | |
| | | ü IO H | | |
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| | | FR4(x,y) Aluminum Copper Stainless Alumina Silicon Steel | | |
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| | | 12 | | |
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