Thermal Clad Selection Guide - Bergquist Company - #14

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Design Considerations When Selecting the Base Metal Layer
▼ Coefficient Of Thermal Expansion And Heat Spreading
▼ Coefficient Of Thermal Expansion And Solder Joints
▼ Strength, Rigidity And Weight
▼ Electrical Connections To Base Layer
▼ Surface Finish
▼ Costs
r
THERMAL
COEFFICIENT OF
MODULUS OF
CONDUCTIVITY
THERMAL EXPANSION
DENSITY
RIGIDITY
YIELD STRENGTH
METAL / ALLOY
[W/mK]
[ppm/K]
[g/cc]
[GPa]
[MPa]
Copper
400
17
8.9
44.1
310
Aluminum 5052
150
25
2.7
25.9
215
Aluminum 6061
150
25
2.7
26
230
304 Stainless Steel
16
16
7.9
200
824
Cold Rolled
Steel
50
13
7.9
200
330
20% AlSiC
175
15
2.8
110
414
30% AlSiC
200
12
2.9
138
418
27% AlSi 177 16 2.7 80 210
Coefficient ofThermal Expansion and Heat Spreading
The adjacent graph depicts the CTE of the base material in relationship to the heat spreading capability of the metal. Although Aluminum and Copper are the most popular base layers used in Thermal Clad other metals and composites have been used in applications where CTE mismatch is a factor. The adjacent table represents standard and non-standard base layers.
Base Layer Selection Considerations
400
350
300
250
200
150
100
50
0
A -
CTE
Thermal Conductivity
£20
V
ü IO H
FR4(x,y) Aluminum Copper Stainless Alumina Silicon Steel
12

pageCatalog pdf di En 2012-02-07-15