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...In Specialty Applications

DBC Replacement

Replace Ceramic Substrates

Thermal Clad can replace large-area ceramic substrates. It canalso be used as a mechanically durable support for ceramic spacers or direct-bond copper sub assemblies. The copper circuit layer of Thermal Clad has more current carrying capability than thick film ceramic technology.

Direct Die Application

Thermal Clad is successfully used in applications requiringdirect die attachment. Die are reflow-soldered to the substrate and then wire bonded to the power and control circuitry to complete the electrical connections. The proper selection of material configuration, copper foil thickness allows for wide temperature range and high current applications. In some applications the copper circuits are nickel/gold plated to provide good solderability and wire bond integrity. If thermosonic gold wire bonding is to be used, it is importantto use HTdielectric because of its high Tg (thus highermodulus) at wire bond temperatures.
Thermal Clad has replaced ceramics and DBC in applications due to mechanicalrobustness and ability to be fabricated in a wide variety of form-factors. Close-up view of direct die attachment. The Thermal Clad substrate is used to mount the die or module.Cross sectional view of heavy copper - two-layer 10 oz. over 10 oz. utilizes Thermal Clad HT dielectric with a 0.020" (0.5mm) copper base heat spreader.

Heavy Copper

Applications requiring heavy copper for high current or heatspreading are not limited to single-layer needs. The ability to have internal layers of heavy copper can provide greater application flexibility. Combined with direct access to the internal copper layer to directly attach or mount components provides unique applications capability.Look for opportunities to reduce the thickness of copper. Inmany applications, our thermal performance reduces the need for heavy copper. 11