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Membrane keyboard, Printed circuit board, Thermally conductive material, Touch screen, Keyboard
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| Thermally Conductive Adhesives | |||||||||||||||||||||||||||||||||||
| Bord-Ry® Acheave | |||||||||||||||||||||||||||||||||||
| Bond-Ply is a thermally conductive, pressure sensitive adhe- • Good thermal performance sive tape,available in either fibergaSs reinforced or unrein- • Immediately bonds to target surface forced.W ith its ability to have a high bond strength, it can • Simulates need for mechanical eliminate the need for screws, clipmounts or fasteners. fasteners or screws • Alternative to heat-cure adhesives | |||||||||||||||||||||||||||||||||||
| "hernial Clad* Conductive | |||||||||||||||||||||||||||||||||||
| Dielectric Layei | |||||||||||||||||||||||||||||||||||
| Traditional Heat Sink or Metal Casing | |||||||||||||||||||||||||||||||||||
| __I_I_I_I_I__ | |||||||||||||||||||||||||||||||||||
| Thermal Interface Compounds | |||||||||||||||||||||||||||||||||||
| C® Thermal Interface Compound | |||||||||||||||||||||||||||||||||||
| TIC isa high performing,thermally conductive grease • High thermal performance designed for use as a thermal interface between an alu- • Good thermal conductivity minum base and a heat sink or metal casngThe compound • Can be screened wets-out the thermal surfaces and flows to produce the • No post "cure" required lowest impedance for your LED application. • Room temperature storage • Exceptional value | |||||||||||||||||||||||||||||||||||
| TIC™ or Bond-Ply* or Gap Pad* | |||||||||||||||||||||||||||||||||||
| Traditional Heat Sink or Metal Casing | |||||||||||||||||||||||||||||||||||
| Thermally Conductive Gap Filling Materials | |||||||||||||||||||||||||||||||||||
| Gap FacParnd Gap Filler Gap Fad and Gap Filler are cost-effective, filled, thermally • Exceptional thermal conductivity conductive interface materialsW ith shock dampening • Electrically isolating abilities, the Gap Fad line is recommended for applications • H ighly conformable, low hardness that require a minimum amount of pressure between • Efficient gap filling material for components Its "gel-like" modulus makes it well suited minimizing component stress in areas where conformity may be a priority \ I / / Gap Pacfor Gap Filler or Bond-Ply" | |||||||||||||||||||||||||||||||||||
| Traditional Heat Sink or Metal Casing | |||||||||||||||||||||||||||||||||||
| Gap Fad® and Gap Filler Slkcone-Free | |||||||||||||||||||||||||||||||||||
| Gap Fad and Gap Filler are also available in a silicone-free • Good thermal conductivity formThese thermally conductive polymers are designed to • Highly conformable, low hardness have similar mechanical benefits as silicone materialsThey are • N aturally tacky on both sides deal for sensitive applicationsthat do not allow silicone, such • Ideal option for silicone sensitive as underwater pools and automotive lighting applications; applications | |||||||||||||||||||||||||||||||||||
| BEHDDUI5T | |||||||||||||||||||||||||||||||||||
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