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Keyboard, Membrane keyboard, Thermally conductive material, Adhesive, Printed circuit board
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| Thermal Clad® Insulated Metal Substrates (IMS) | |||||||||||||||||||||||||||
| Thermal Clad® PrePreg Rollsand Sheets | |||||||||||||||||||||||||||
| Bond-Ply TCP-1000 is a B-stage prepreg designed to meet the thermal management challenges of Power LED applications With its superior thermal performance, BergquistS Bond-Ply TCP-1000 effectively competes with epoxy gass on aluminum constructions. It combines ease of processing with the high performance characteristics of | 18"(4572mm) roll standard (custom sizes available) Maximum roll length of 500 feet (1524m) Sheets18"x24"(457.2mm x 6096mm) and 20'X24"(508mm x 6096mm) | ||||||||||||||||||||||||||
| a thermally conductive polymer dielectric. It is specifically intended as a high performance alternative to epoxy gass on aluminum constructonsThe thermal performance is better than traditional epoxy gass constructions by at least 35x thus allowing for performance eves needed to increase lumens per watt output while eflectively managing LED device temperature. Thermal Clad® Panels | |||||||||||||||||||||||||||
| Thermal Clad is a dielectric (ceramic-polymer blend) coated metal base with a bonded copper circuit layer. Improved reliability; processing advantages and exceptional cost performance rmtesTherrraJ Clad a superior alternative to | • Circuit layer - 35|jm to 350|jm • Delectric layer - HT, LTI, MP • Base plate copper or aluminum 0020'-0.125" (05mm-32mm) | ||||||||||||||||||||||||||
| traditional FR4 and non-thermally conductive constructions: Thermal Clad substrates are available in a variety of thicknesses depending on the base metal and circuit foil thickness Standard sheet sizes are 18"x 24" and 20"x 24" Material selection should be based on thermal, dielectric and mechanical application requirements Thermal Clad® Printed Circut Boards(PCB) | |||||||||||||||||||||||||||
| Bergquist Thermal Clad circuit boards are the answer for designerswanting the best of both worlds. Rower LED light output and lfecycles are directly attributed to how well the package is managed thermallyA Thermal Clad board offers superior heat transfer. As a metal based material Thermal Clad can be configured for shapes, bends and thicknesses allowing installation in virtually any application.W ith a Thermal Clad board you're assured of the lowest operating temperature, maximum LED color consistency and life. | • Circuit layer - 35|m to 350|m • Delectric layer - HT, LTI, MP • Base plate copper or aluminum 0.020"-0.125"(0.5mm-3.2mm) | ||||||||||||||||||||||||||
| Thermally Conductive Adhesives | |||||||||||||||||||||||||||
| □qu-Bond® Adhesive Uqui-Bond isa thermally conductive liquid silicone adhesive that curesto a solid bonding elastomer. Liqui-Bond features excellent low and high-temperature mechanical and chemical stability. It can be supplied in either a tube or mid-sized container form. | |||||||||||||||||||||||||||
| • High thermal conductivity • Easy dispensing • Can achieve a very thin bond line • Heat cure | |||||||||||||||||||||||||||
| Liqui-Bond* or Bond-Ply® | |||||||||||||||||||||||||||
| Thermal Clad* Conductive Dielectric Layer | |||||||||||||||||||||||||||
| f BEDDDUI5T ^ COMPANY | |||||||||||||||||||||||||||