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Keyboard, Printed circuit board, Thermally conductive material, Adhesive, Touch screen
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| Bergquist Makes Thermal Management Simple For Today's High Brightness LEDs. | ||||||||||||||||||||||||||||||||||||||||||||||
| A Bright New Chapter Unfolds Now that Rawer LEDsare capable of unprecedented levelsof white LED brightnessand efficacy they are being used in many products that are part of our daily lives Although today the initial cost of Rower LEDs is higher, many applications have demonstrated LED lighting asthe most cost or energy efficient solution for future installations. Equipment manufacturers worldwide are making devices with Rower LEDs for both the commercial and consumer segments W ith smaller footprints, our products lead the way in reducing the buildup of heat and maximee the LEDs potential benefits. Bergquist provides critical thermal management support for a myriad of Rower LED applications that include: medical, military, signage, signal, transport* tion, aircraft, automotive, security, portable, theatrical, commercial and residential lighting. | ||||||||||||||||||||||||||||||||||||||||||||||
| A complete thermal package letsyou leap the benefits of todays new Power LW's | ||||||||||||||||||||||||||||||||||||||||||||||
| The Power Factor Evolves With the era of brighter and more powerful LEDswe are witnessing the world of lighting changing forever. Power LEDs are entering nearly every market niche asthe light source of choice. Advancements in LED technology has led to a cost-effective alternative to incandescent, fluorescent and halogen lightingWith these bring significant opportunities to LED manufacturers and integrators. Power LED packaging hasevolved to adapt to higher power dissipation demandsFor these Power LED packages the lowest possible thermal resistance packagng is paramount to a long and reliable service life. Ey combining Bergquist thermal management materialswith this new and innovative packagng progress in both light output and light quality can be achieved. The Bergquist Company has established itself as one of the worlds foremost leaders in thermal management solutions; From innovative new productsto gobal support, Bergquist is your total thermal management supplier. With the depth of our product portfolio, Bergquist promises to make these challenging new thermal hurdles less daunting.Whether you're a manufacturer, an integrator or a company that procuresthe final package,you'll benefit from a Bergquist solution. | ||||||||||||||||||||||||||||||||||||||||||||||
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| Typical Types Of LED Packages | ||||||||||||||||||||||||||||||||||||||||||||||
| Bergquist thermal products are hard at work keeping the worlds best known products reliably cod. | ||||||||||||||||||||||||||||||||||||||||||||||
| Whether above or below gound,the rangs of usesfor Power LEDs is ever expanding. Leading automotive manufacturers have not only begun to move Power LEDs into interiors and signals, but forward LED lighting is now available on an ever increasing number of vehicles; Bergqusts slicone-free materials are an excellent choice for automotive and submersible applications; By using copper based Thermal Clad, along with Slicone-Ree Gap Pad, unique agency requirements for UL approval in underwater lighting applications, such as pools, can be met. As a one-source supplier, this right combination of thermal interface and substrate materialsallows customers to quickly meet their objectives; EasingThe Thermal IssuesAhead Be confident specifying your Power LEDs at their maximum power levels by partnering with an expert in thermal management. Our vast experience in the thermal field, coupled with our solid customer-focused solutions, makes usthe best choice for thermal design choices; Rely on Bergquist to stay on top of Power LED packaging and continue to innovate and market thermal material solutions for this rapidly expanding technology; Extend performance, durability and reliability by including us in your Power LEDs equation. | ||||||||||||||||||||||||||||||||||||||||||||||
| Printed Circuit Board (Substrate) Standard Chip-On-Board (COB) | ||||||||||||||||||||||||||||||||||||||||||||||
| Gold Wire LED Chip | ||||||||||||||||||||||||||||||||||||||||||||||
| Epoxy Dome Lens | ||||||||||||||||||||||||||||||||||||||||||||||
| Anode *T Solder | ||||||||||||||||||||||||||||||||||||||||||||||
| Printed Circuit Board (Substrate) Thermally Optimized | ||||||||||||||||||||||||||||||||||||||||||||||
| Reflective Layer | ||||||||||||||||||||||||||||||||||||||||||||||
| Phosphorus-Doped Epoxy Blue-Emitting LED Chip | ||||||||||||||||||||||||||||||||||||||||||||||
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| Printed Circuit Board (Substrate) Recessed Die | ||||||||||||||||||||||||||||||||||||||||||||||
| Gold Wire | ||||||||||||||||||||||||||||||||||||||||||||||
| Conductive Paste | ||||||||||||||||||||||||||||||||||||||||||||||
| Printed Circuit Board (Substrate) Dome Die | ||||||||||||||||||||||||||||||||||||||||||||||
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