| | | transguard® surface mount devices The move toward SMT assembly of Transient Voltage Suppressors (TVS) will continue accelerating due to improved long-term reliability, more efficient transient voltage attenuation and size/functionality/cost issues. TransGuards® are uniquely suited for wide-scale usage in SMT applications. TransGuards® exhibit many advantages when used in SMT assemblies. Among them are: • Available in standard EIA chip sizes 0402/0603/0805/ 1206/1210. • Placed with standard equipment (8mm tape and reel). • Processed with fewer guidelines than either ceramic chip or resistor chip devices. • Exhibit the highest energy/volume ratio of any EIA size TVS. This general guideline is aimed at familiarizing users with the characteristics of soldering multilayer SMT ZnO TransGuards®. TransGuards® can be processed on wave or infrared reflow fitting lines. For optimum performance, EIA standard solder pads (land areas) shown in Figure 1 are recommended regardless of the specific attachment method. Dimensions: mm (inches) | | storage Good solderability of plated components is maintained for at least twelve months, provided the components are stored in their "as received" packaging at less than 30°C and 85% RH. solderability Plated terminations will be well soldered after immersion in a 60/40 tin/lead solder bath at 235°C ±5°C for 5 ±1 seconds. leaching Plated terminations will resist leaching for at least 30 seconds when immersed in 60/40 tin/lead solder at 260°C ±5°C. recommended soldering profiles Recommended Reflow Profiles | | |