TransFeed AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip

DIMENSIONS

mm (inches)

LWTBWBLEWXS 0805 2.01 ± 0.201.25 ± 0.201.143 Max.0.46 ± 0.100.18 + 0.25 -0.080.25 ± 0.131.02 ± 0.100.23 ± 0.05(0.079 ± 0.008)(0.049 ± 0.008)(0.045 Max.)(0.018 ± 0.004)(0.007 + 0.010 -0.003)(0.010 ± 0.005)(0.040 ± 0.004)(0.009 ± 0.002)

L X S T BW CL BL W EW

RECOMMENDED SOLDER PAD LAYOUT (Typical Dimensions)

mm (inches)

TPSWLC 0805 3.45 (0.136)0.51 (0.020)0.76 (0.030)1.27 (0.050)1.02 (0.040)0.46 (0.018)

4 Pad Layout

T P INPUTOUTPUT P S W C L

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