Catalogues - avx-rf-microwave-thin-film-products

Catalogue AVX RF Microwave Thin-Film Products

www.avx.com

Page

/ 136

Contact the
Manufacturer

Where to buy
this product ?

Request
a Quote

/ 136

See other catalogues for AVX

Text version of the page

Accu-L®0805

Application Notes

HANDLING

SMD chips should be handled with care to avoid damage or contamination from perspiration and skin professional oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Manufacturer of bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine.

ßSfMRF

PREHEAT & SOLDERING

The rate of preheat in production should not exceed 4°C/second. It is recommended not to exceed 2°C/ second.

Temperature differential from preheat to soldering should not exceed 150°C.

For further specific application or process advice, please consult AVX.

HAND SOLDERING & REWORK

Hand soldering Is permissible. Preheat of the PCB to 100°C Is required. The most preferable technique Is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 30 watts should be used and set to not more than 260°C. Maxl mum al I owed time at temperature is 1 minute. When hand solderl ng, the base side (white side) must be soldered to the board.

COOLING

After soldering, the assembly should preferably be al I owed to cool naturally. In the event of assisted cool I ng, similar conditions to those recommended for preheat I ng should be used.

CLEANING RECOMMENDATIONS

Care should be taken to ensure that the devices are thorough ly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows:

CIRCUIT BOARD TYPE

All flexible types of circuit boards may be used (e.g. FR-4, G-10) and also alumina.

For other circuit board materials, please consult factory.

COMPONENT PAD DESIGN

Component pads must be designed to achieve good joints and minimize component movement during solderi ng.

Pad designs are given below for both wave and reflow soldering.

The basis of these designs is:

a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go bel ow this.

b. Pad overlap about 0.3mm.

c. Pad extension about 0.3mm for reflow.

Pad extension about 0.8mm for wave soldering.

I_ U l_ 111 11

Cleaning liquids

i-propanol, ethanol, acetylace-tone, water, and other standard PCB cleaning liquids.

power - 20w/liter max. frequency - 20kHz to 45kHz.

80°C maximum (if not otherwise limited by chosen solvent system).

5 minutes max.

IMENSIONS: millimeters (inches)

TÏ

(0.122) _ogo(0.020)

Ultrasonic conditions

Temperature.


r		0805
		Accu-L®
	(0.059)	Accu-L®

Time.

0603

Accu-L®

STORAGE CONDITIONS

Recommended storage conditions for Accu-L® prior to use are as follows:

REFLOW SOLDERING DIMENSIONS: millimeters (inches)

Temperature. Humidity . . . Air Pressure.

15°C to 35°C <65%

860mbar to 1060mbar

0.90 (0.035)

(0.028)

2.3

p.09i;

(0.020)

2.8 1.4 ;0.1 10) (0.055)


	T
	0.90
	(0.035)
	'■ 1
		-«-0 8-*.
		(0.031)

RECOMMENDED SOLDERING

PROFILE

For recommended soldering profile see page 23

0603

Accu-L^®

0805

Accu-L^®

0.7

j (0.028)

. 1.5 . (0.059)