Catalogue AVX RF Microwave Thin-Film Products
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Accu-F® / Accu-P®
Application Notes
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PREHEAT & SOLDERING
The rate of preheat in production should not exceed 4°C/ second and a recommended maximum is about 2°C/second. Temperature differential from preheat to soldering should not exceed 100°C.
For further specific application or process advice, please consult AVX.
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows:
Cleaning liquids....... i-propanol, ethanol, acetylacetone,
water and other standard PCB cleaning liquids.
Ultrasonic conditions . . power-20w/liter max.
frequency-20kHz to 45kHz.
Temperature.........80°C maximum (if not otherwise
limited by chosen solvent system).
Time...............5 minutes max.
COOLING
After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be
used.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 150°C is required. The most preferable technique is to use hot air sol­dering tools. Where a soldering iron is used, a temperature controlled model not exceeding 30 watts should be used and set to not more than 260°C.
STORAGE CONDITIONS
Recommended storage conditions for Accu-F® and Accu-P® prior to use are as follows:
Temperature..........15°C to 35°C
Humidity.............<65%
Air Pressure.......... 860mbar to 1060mbar
VAPOR PHASE
- Transferfrom preheat with min. delay & temp. loss
Reflow
Preheat
215°C
200
Duration varies with thermal mass of assembly 10-60 sees typical
Natural i Cooling
180­160­140­120­100­80­60­40 20
180 160 140 120
O
LU
CE
z>
LU Q.
LU
Enter Vapor
100 80 60 40 20
0
0
10 20
30 40 50 Time (seconds)
60 70
Time (minutes)
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