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| | | Surface Mounting Guide Chip Thermistor - Application Notes | | |
| | | /aV№( | | |
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| | | STORAGE Good solderability is maintained for at least twelve months, provided the components are stored in their "as received" packaging at less than 40°C and 70% RH. | | |
| | | Wave 300 | | |
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| | | 250H | | |
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| | | SOLDERABILITY / LEACHING Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ± 5°C for 2 ±1 seconds. Terminations will resist leaching for at least the immersion times and conditions recommendations shown below. | | |
| | | E cd o S | | |
| | | 150H | | |
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| | | 100 | | |
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| | | 50 H | | |
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| | | | | | | | | | | | | P/N | Termination | Solder | Solder | Immersion | | | | | Type | Tin/Lead | Temp °C | Time Seconds | | | | NC | AgPdPt | 60/40 | 260 ±5 | 15 max | | | | NB | Nickel Barrier | 60/40 | 260 ±5 | 30 ± 1 | | | | | | | | | | | | |
| | | 0 | | |
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| | | 1 to 2 min | | |
| | | 3 sec. max | | |
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| | | (Preheat chips before soldering) T/maximum 150°C The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. Resin color may darken slightly due to the increase in temperature required for the new pastes. Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. | | |
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| | | a) | | |
| | | NB products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. This includes Pb free reflow processes with peak temperatures up to 270°C. Recommended profiles for reflow and wave soldering are shown below for reference. NC products are recommended for lead soldering application or gluing techniques. | | |
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| | | b) | | |
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| | | c) | | |
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| | | Reflow 300 250 | | |
| | | D2 | | |
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| | | RECOMMENDED SOLDERING PAD LAYOUT Dimensions in mm (inches) REFLOW SOLDERING | | |
| | | D1 D3 | | |
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| | | D4 | | |
| | | 200 150 100 50 0 | | |
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| | | E Ì53 o co | | |
| | | D5 | | |
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| | | | | | | | | | | | | | | Case Size | P/N | D1 | D2 | D3 | D4 | D5 | | | | 0402 | NB23 | 1.70 | 0.60 | 0.50 | 0.60 | 0.50 | | | | (.067) | (.024) | (.020) | (.024) | (.020) | | | | 0603 | NB21 | 2.30 | 0.80 | 0.70 | 0.80 | 0.75 | | | | (.091) | (.031) | (.028) | (0.31) | (.030) | | | | 0805 | NB12 | 3.00 | 1.00 | 1.00 | 1.00 | 1.25 | | | | (.118) | (.039) | (.039) | (.039) | (.049) | | | | 1206 | NB20 | 4.00 | 1.00 | 2.00 | 1.00 | 2.50 | | | | (.157) | (.039) | (.079) | (.039) | (.098) | | | | WAVE SOLDERING | | | | Case Size | P/N | D1 | D2 | D3 | D4 | D5 | | | | 0603 | NB21 | 3.10 | 1.20 | 0.70 | 1.20 | 0.75 | | | | (.122) | (.047) | (.028) | (.047) | (.030) | | | | 0805 | NB12 | 4.00 | 1.50 | 1.00 | 1.50 | 1.25 | | | | (.157) | (.059) | (.039) | (.059) | (.049) | | | | 1206 | NB20 | 5.00 | 1.50 | 2.00 | 1.50 | 1.60 | | | | (.197) | (.059) | (.079) | (.059) | (.063) | | | | | | | | | | | | | | |
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| | | 1min 1min 10 sec. max (Minimize soldering time) | | |
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| | | 300
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| | | u o a> a E | | 250 200 150 100 | | |
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| | | 50 0 | | |
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| | | 0 | | 50 | | 100 | | 150 | | 200 | | 250 Time (s) | | 300 | | |
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| | | • Pre-heating: 150°C ±15°C / 60-90s • Max. Peak Gradient: 2.5°C/s • Peak Temperature: 245°C ±5°C • Time at >230°C: 40s Max. | | |
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| | | 18 | | |
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