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| | Test | Page # | Reference | Sample size per lot | Tests Description | Criterion | |
| | High Temperature Exposure (Storage) | 3 | Mil-std-202 method 108 | 77 | 1000h at rated operating temperature (125°C) Unpowered Measurement 24h after test conclusion | C = within ± 7% of initial value Delta DF < or = 50.10-4at 1kHz IR = not less than 50% of initial limit | |
| | Temperature Cycling | 4 | JESD22 method JA-104 | 77 | 1000 cycles (-55°C to +125°C) 2 cycles per hour - gradient 15°C/mn Measurement after 24h at 100°C | C = within ± 5% of initial value Delta DF < or = 50.10-4at 1kHz IR = not less than 50% of initial limit | |
| | Moisture resistance | 6 | Mil-std-202 method 106 | 77 | t=24 hours/cycle. Note Steps 7A and 7B not required - Unpowered Measurement after 24h at 100°C | C = within ± 8% of initial value Delta DF < or = 70.10-4at 1kHz IR = not less than 50% of initial limit | |
| | Biased humidity | 7 | Mil-std-202 method 103 | 77 | 1000 hours 40°C/93%RH Rated Voltage or 48V max Measurement after 24h at 100°C | C = within ± 8% of initial value Delta DF < or = 70.10-4at 1kHz IR = not less than 50% of initial limit | |
| | Operational Life | 8 | Mil-std-202 method 108 | 77 | 1000 hours at 125°C 100% of Rated Voltage Measurement 24h after test conclusion | C = within ± 7% of initial value Delta DF < or = 50.10-4at 1kHz IR = not less than 50% of initial limit | |
| | Resistance to solvents | 12 | Mil-std-202 method 215 | 5 | OKEM clean or equivalent | No visible damage | |
| | Mechanical shock | 13 | Mil-std-202 method 213 | 30 | 18 shocks Condition C 1/2 sinusoid 6 msec. 100g's | C = within ± 2% of initial value Delta DF < or = 50.10-4at 1kHz IR = not less than 50% of initial limit | |
| | Vibration | 14 | Mil-std-202 method 204 | 30 | 12 cycles each of 3 orientations 5g's for 20 minutes Test from 10-2000 Hz | C = within ± 2% of initial value Delta DF < or = 50.10-4at 1kHz IR = not less than 50% of initial limit | |
| | Resistance to soldering heat | 15 | Mil-std-202 method 210 | 30 | for SMD use Procedure 2 (235°C / 30 sec.) 3 times | C = within ± 5% of initial value Delta DF < or = 50.10-4at 1kHz IR = not less than 50% of initial limit | |
| | Thermal Shock | 16 | Mil-std-202 method 107 | 30 | -55°C/+125°C 300 cycles - transfert 20 sec max Dwell Time =15minutes Measurement 24h after test conclusion | C= within ± 5% of initial value Delta DF < or = 50.10-4 at 1kHz IR = not less than 50% of initial limit | |
| | ESD | 17 | AEC-Q200-002 | 15 | Ongoing | |
| | Solderability | 18 | J-STD-002 replaced by: JESD22-B102D | 15 | dipping in solder bath SnPb at 235°C during 3 or 5 sec depending on case size | 90% solder coverage minimum | |
| | Electrical Characterization | 19 | User spec. | 30 | Electrical characteristics measured at : -55°C / +25°C / +125°C | Summary to show Min, Max, Mean and standard deviation at room, Min and Max operating temperatures. | |
| | Flammability | 20 | UL-94 | 10 | 20 mm vertical burning test V-0, V-1 or V-2 Electrical Test not required | V-0 or V-1 are acceptable | |
| | Board Flex | 21 | AEC-Q200-005 | 30 | 2mm minimum | C = within ± 2% of initial value No visible damage | |
| | Terminal Strength | 22 | AEC-Q200-006 | 30 | a force of 1.8 kg for 60s | No visible damage | |
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