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HOW TO ORDER CB 04 2 G 0104 K -- Type Size Dielectric Voltage Capacitance ToleranceEIA Code Suffix Packaging CB: SMD Lead Free
CL 01: 1206
02: 1210
03: 1812
04: 2220
05: 2824
95: 2840
16: 4030
17: 5040
18: 6054 2 = PET-HT
8 = PPS
7 = PEN B = 16VC = 25V
D = 50/63VE = 100VG = 250VI = 400VK = 630V 1st digit: 02nd & 3rd: the 2ndsignificant figures of thecapacitance value.4th digit: the number ofzeros to be added to thecapacitance value. -- = bulkBA = tape & reeldiameter: 180mmBC = tape & reeldiameter: 330mm G (1) = 2%J = 5%K = 10% Example of an order: How to order a chip film PET-HT 100nF ±10% 250V bulk packaging. (1) : Tolerance G available only for PPS Series. W
LHT CASE DIMENSIONS: millimeters (inches) Size CodeEquivalent sizeLength (L)Width (W)Termination Return 0112063.30±0.30 (0.130±0.012)1.60±0.30 (0.063±0.012)0.50±0.30 (0.020±0.012) 0212103.30±0.30 (0.130±0.012)2.50±0.30 (0.098±0.012)0.50±0.30 (0.020±0.012) 0318124.50±0.50 (0.177±0.020)3.20±0.50 (0.126±0.020)0.60±0.40 (0.024±0.157) 0422205.80±0.50 (0.228±0.020)5.00±0.50 (0.197±0.020)0.80±0.60 (0.032±0.024) 0528247.20±0.50 (0.283±0.020)6.10±0.50 (0.240±0.020)0.80±0.60 (0.032±0.024) 9528407.20±0.50 (0.283±0.020)10.0±0.80 (0.343±0.031)0.80±0.60 (0.032±0.024) 16403010.5±0.60 (0.413±0.024)7.60±0.80 (0.299±0.031)0.80±0.60 (0.032±0.024) 17504012.8±0.60 (0.504±0.024)10.2±0.80 (0.401±0.031)0.80±0.60 (0.032±0.024)18605415.3±0.60 (0.602±0.024)13.7±0.80 (0.539±0.031)0.80±0.60 (0.032±0.024) STACKED FILM CONSTRUCTION Our SMD Film capacitors (CB series) are using stacked tech-nology with metallized plastic film, which forms the basis for
the capacitive element. Combined with the nacked design
choice, it gives our products an again better self-healing
capability as well as a very good capacitance per volume
ratio. This also means that internal construction of the multi-
layer stack, usually hidden in encapsulated film supplier of capacitors
design, is visible at the cut edges in the surface mount con-
figuration. In a typical film capacitor stack, hundreds of film
layers are compacted during manufacture. Under a micro-
scope these have the appearance of pages in a book.Subsequent manufacturing and pcb assembly processes
allow a small amount of relaxation in these layers. In some
cases, small gaps between layers may become visible. These
are referred to as microgaps, and their occurrence is a stan-
dard feature of this technology. Even if it can be considered
an cosmetic issue, presence of these gaps has no effect at all
on mechanical or electrical performance or reliability. (Detailed
report is available upon request.) 6
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