MOUNTING AND SOLDERING RECOMMENDATIONS SOLDERING PROFILE
The suppliers of capacitors can be mounted using infrared and vapor phase soldering following recommended below. They are NOT suitable for wave soldering.
PhaseSizeTemperature (°C)*Time (s) Preheating
All160 to 180°C max180s max. Soldering
1206 to 1812T max= 250°C and 10 s between T max and Tmax-5°C60s at temperature> 217°C 2220 to 6054T max= 255°C and 10 s between T max and Tmax-5°C75s at temperature > 217°C *Reflow soldering referring to JEDECStandard with some limitations*JEDEC J-Std 020C RECOMMENDED SOLDER PASTE THICKNESS
For optimum solderability, the recommended soldering
paste thickness: 1206 to 2824 :150 to 200µmIn case of hand soldering, the temperature of the solderingiron should not be above 250°C. Special care must be taken
to avoid touching the capacitor body with the iron tip.
PAD DIMENSIONS:
millimeters (inches) Size CodeCase SizeABC
0112061.30 (0.051)1.30 (0.051)2.20 (0.087) 0212102.00 (0.079)1.30 (0.051)2.20 (0.087) 0318123.00 (0.118)1.50 (0.059)3.50 (0.137)
ACB 0422205.00 (0.195)1.90 (0.075)4.50 (0.178) 0528246.00 (0.234)2.50 (0.098)5.70 (0.224) 1640307.50 (0.295)3.00 (0.118)8.00 (0.315) 17504011.2 (0.441)3.50 (0.137)10.3 (0.406)18605414.6 (0.575)3.60 (0.147)12.6 (0.496)
RECOMMENDED CLEANING OTHER CAUTIONS
To clean flux from the PC board assembly, the recommended
products are: ethanol, isopropyl alcohol, and deionized water
wash. The cleaning products to avoid are: Toluene, Xylene,
Trichloroethylene, Terpene Cleaner EC-7, surface active
agent. In case of using another solvent, please contact us. Flame retardancy: the dielectric film is not a flame retardantmaterial. Environment: contact us when chips are used in humid orgas atmosphere and /or when using resin. Recommended handling: do not use edged tools, so notto damage the capacitors.
TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121
Stress TypeRef. Spec.Test ConditionsAnalysisResults Temperature cyclingJESD22-A104-55°C +85(+10/-0)°C air 5 SEM x 1000Pass to 10mn soak 3 cycles/hourAmbient Temperature /30+/-2°C - 60+/-3% RH -2000HSEM x 1000Pass Humidity StorageHigh Temperature /70+/-5°C - 93+3/-2% RH -1000HSEM x 1000PassHumidity Storage
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