| | | QUALITY & RELIABILITY Accu-Guard® series of fuses is based on established thin-film technology and materials used in the semiconductor industry. • In-line Process Control: This program forms an integral part of the production cycle and acts as a feedback system to regulate and control production processes. The test procedures, which are integrated into the production process, were developed after long research and are based on the highly developed semiconductor industry test procedures and equipment. These measures help AVX/Kyocera to produce a consistent and high yield line of products. • Final Quality Inspection: Finished parts are tested for standard electrical parameters and visual/mechanical characteristics. Each production lot is 100% evaluated for electrical resistance. In addition, each production lot is evaluated on a sample basis for: • Insulation resistance (post fusing) • Blow time for 2 x rated current • Endurance test: 125°C, rated current, 4 hours HANDLING AND SOLDERING SMD chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped industrial tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. CIRCUIT BOARD TYPE All flexible types of circuit boards may be used (e.g. FR-4, G-10). For other circuit board materials, please consult factory. WAVE SOLDERING Dimensions: millimeters (inches) | | COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs are: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap 0.5mm. c. Pad extension 0.5mm for reflow. Pad extension about 1.0mm for wave soldering. PREHEAT & SOLDERING The rate of preheat in production should not exceed 4°C/second. It is recommended not to exceed 2°C/ second. Temperature differential from preheat to soldering should not exceed 150°C. For further specific application or process advice, please consult AVX. HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 100°C is required. The most preferable technique is to use hot air soldering tools. Where a soldering iron is used, a temperature controlled model not exceeding 30 watts should be used and set to not more than 260°C. Maximum allowed time at temperature is 1 minute. COOLING After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. | | |