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Biasing for Sub-Harmonic Mixing The LO amplier in the AMMC-3040 can also be used as a frequency doubler. Optimum conversion eciency as a doubler is obtained with an input power level of 3 to 8 dBm.Frequency multiplication is achieved by reducing the bias on the rst stage FET to eciently generate har-
monics. The remaining three stages are then used to provide amplication. While many bias methods could be used to generate and amplify the desired harmonics within the AMMC-
3040’s LO amplier, the following information is sug-
gested as a starting point for subharmonic mixing applications. Frequency doubling is accomplished by biasing the rst stage FET at pinch-o by setting V
g1 = V
p ≈ –1.1 volts. The remaining three stages are biased for normal amplication, e.g., V The backside of the AMMC-3040 chip is RF ground. For microstripline applications, the chip should be attached directly to the ground plane (e.g., circuit carrier or heat- sink) using electrically conductive epoxy The IF output port is located near the middle of the die, allowing this connection to be made from either side of the chip for maximum layout exibility. The LO and RF signals are reectively terminating at the IF port by connecting a 20-mil (500 µm) long bond wire from the IF output pad on the MMIC to a shunt 0.6 pF chip capacitor mounted o- chip as indicated in Figure 16. ≥ 100 pF to assure stability.
gg is adjusted such that I
d2 + I
d3 + I
d4 ≈ 250 mA. The drain voltage, Vdd, for all four stages should be 3.5 to 4.5 volts. The assembly diagram shown in Figure 16(b) can be used as a guideline.In all cases, Cb Assembly Techniques is recommended for best performance, especially near the high end of the frequency range. Thermosonic wedge bonding is the preferred method for wire attachment to the bond pads. Gold mesh can be attached using a 2 mil round tracking tool and a tool force of approximately 22 grams with an ultrasonic power of roughly 55 dB for a duration of 76 ± 8 mS. A guided wedge at an ultrasonic power level of 64 dB can be used for the 0.7 mil wire. The recommended wire bond stage temperature is 150 ± 2°C. Caution should be taken to not exceed the Absolute Maximum Ratings for assembly temperature and time.The chip is 100 µm thick and should be handled with care. This MMIC has exposed air bridges on the top surface and should be handled by the edges or with a custom collet (do not pick up die with vacuum on die center.)This MMIC is also static sensitive and ESD handling precautions should be taken. IF Output Port
[1,2] .For best performance, the topside of the MMIC should be brought up to the same height as the circuit sur- rounding it. This can be accomplished by mounting a gold plated metal shim (same length and width as the MMIC) under the chip, which is of the correct thickness to make the chip and adjacent circuit coplanar. The amount of epoxy used for chip and or shim at-tachment should be just enough to provide a thin llet around the bottom perimeter of the chip or shim. The ground plane should be free of any residue that may jeopardize electrical or mechanical attachment. For use on coplanar circuits, the chip can be mounted directly on the topside ground plane of the circuit as long as care is taken to ensure adequate heat sinking. Multiple vias underneath the chip will significantly improve heat conduction. The location of the RF, LO, and IF bond pads is shown in Figure 15. Note that all RF input and output ports are in a Ground-Signal-Ground conguration. The IF port is located near the middle of the die, which allows for maximum layout exibility since the IF connection can be made from either side of the chip. RF connections should be kept as short as reasonable to minimize performance degradation due to series inductance. A single bond wire is sucient for all signal connections. However, double-bonding with 0.7 mil gold wire or the use of gold mesh
1. Ablebond 84-1 LM1 silver epoxy is recommended. 2. Eutectic attach is not recommended and may jeopardize reliability of the device. Notes: Ordering Information: AMMC-3040-W10 = 10 devices per tray AMMC-3040-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3932EN AV02-1040EN - June 24, 2008
g1 = V
p ≈ –1.1 volts. The remaining three stages are biased for normal amplication, e.g., V The backside of the AMMC-3040 chip is RF ground. For microstripline applications, the chip should be attached directly to the ground plane (e.g., circuit carrier or heat- sink) using electrically conductive epoxy The IF output port is located near the middle of the die, allowing this connection to be made from either side of the chip for maximum layout exibility. The LO and RF signals are reectively terminating at the IF port by connecting a 20-mil (500 µm) long bond wire from the IF output pad on the MMIC to a shunt 0.6 pF chip capacitor mounted o- chip as indicated in Figure 16. ≥ 100 pF to assure stability.
gg is adjusted such that I
d2 + I
d3 + I
d4 ≈ 250 mA. The drain voltage, Vdd, for all four stages should be 3.5 to 4.5 volts. The assembly diagram shown in Figure 16(b) can be used as a guideline.In all cases, Cb Assembly Techniques is recommended for best performance, especially near the high end of the frequency range. Thermosonic wedge bonding is the preferred method for wire attachment to the bond pads. Gold mesh can be attached using a 2 mil round tracking tool and a tool force of approximately 22 grams with an ultrasonic power of roughly 55 dB for a duration of 76 ± 8 mS. A guided wedge at an ultrasonic power level of 64 dB can be used for the 0.7 mil wire. The recommended wire bond stage temperature is 150 ± 2°C. Caution should be taken to not exceed the Absolute Maximum Ratings for assembly temperature and time.The chip is 100 µm thick and should be handled with care. This MMIC has exposed air bridges on the top surface and should be handled by the edges or with a custom collet (do not pick up die with vacuum on die center.)This MMIC is also static sensitive and ESD handling precautions should be taken. IF Output Port
[1,2] .For best performance, the topside of the MMIC should be brought up to the same height as the circuit sur- rounding it. This can be accomplished by mounting a gold plated metal shim (same length and width as the MMIC) under the chip, which is of the correct thickness to make the chip and adjacent circuit coplanar. The amount of epoxy used for chip and or shim at-tachment should be just enough to provide a thin llet around the bottom perimeter of the chip or shim. The ground plane should be free of any residue that may jeopardize electrical or mechanical attachment. For use on coplanar circuits, the chip can be mounted directly on the topside ground plane of the circuit as long as care is taken to ensure adequate heat sinking. Multiple vias underneath the chip will significantly improve heat conduction. The location of the RF, LO, and IF bond pads is shown in Figure 15. Note that all RF input and output ports are in a Ground-Signal-Ground conguration. The IF port is located near the middle of the die, which allows for maximum layout exibility since the IF connection can be made from either side of the chip. RF connections should be kept as short as reasonable to minimize performance degradation due to series inductance. A single bond wire is sucient for all signal connections. However, double-bonding with 0.7 mil gold wire or the use of gold mesh
1. Ablebond 84-1 LM1 silver epoxy is recommended. 2. Eutectic attach is not recommended and may jeopardize reliability of the device. Notes: Ordering Information: AMMC-3040-W10 = 10 devices per tray AMMC-3040-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3932EN AV02-1040EN - June 24, 2008