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| ANSYS | ||||||||||||||||||||||||||||||
| 11.0 RELEASE | ||||||||||||||||||||||||||||||
| Export the model to ANSYS® or ANSYS® Workbench™ for stress analysis Export the geometry to Icepak® for systems-level simulation Define non-uniform power to predict chip hot spots; power can be temperature dependent Accurate 3-D models automatically generated Fast solve times, usually in minutes Includes a library of standard JEDEC boards | Automatic 3-D Models ANSYS Icechip software automatically generates fully detailed three-dimensional models. An unstructured triangular mesher is used to capture complex geometries such as component lead frames. The substrate of a ball grid array is three-dimensionally simulated accounting for every trace, plane and via as a local heat transfer path. Complex algorithms process the exact geometry imported from the ECAD tool and locally represent it at the meshed element level. This methodology results in an accurate simulation that can still be solved in minutes. An imported JEDEC board library file is similarly three-dimensionally represented. This results in accuracies of better than 10 percent of standard JEDEC Theta-JA simulations when compared with test data. Benefits ► Thermally design components quickly and accurately ► Work easily and intuitively ► Automatically produce detailed 3-D models ► Flexibility to simulate today's complex packages — as well as tomorrow's | |||||||||||||||||||||||||||||
| BGA substrate data imported from Cadence Allegro Package Designer | ||||||||||||||||||||||||||||||
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| Package-on-package simulating a standard JEDEC Theta-JA thermal test | ||||||||||||||||||||||||||||||
| Package-on-package cross section showing temperatures | ||||||||||||||||||||||||||||||
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