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For the very latest specifications visit www.aeroflex.com
The Layer 1 / Layer 2 and Higher Layer options extend the capabilities of the TM500 test mobile to
support the latest 3GPP Release 6 High Speed Uplink Packet Access (HSUPA) technology
TM500 Test Mobile
3GPPRelease 6 HSUPAOption
• Full Layer 1 / Layer 2 implementation of
3GPP Enhanced Uplink features
• E-DCH data rates up to 5.76Mbps
• Flexible configuration of HSUPA, HSDPA
and R99 functionality
• Full support of HSUPA and HSDPA UE
capability classes
• Simultaneous HSUPA and HSDPA
operation at maximum data rates
• Innovative test features to assist Node B /
RNC development and regression test
• Flexible soft handover configuration for
monitoring serving and non-serving radio
links
• Support of scheduled and non-scheduled
data
• Data Service Generator allows easy
configuration of packet-switched service
profiles
• High Speed Baseband Logging
• Optional Release 6 Layer 3 and NAS
functionality to provide full protocol
capabilities for system test
The TM500 test mobile platform is the industry standard for
HSDPA infrastructure development and test. The HSUPA options,
consisting of Layer 1/Layer 2 and Higher Layer Protocol
functionality, extend these features to include the latest 3GPP
Enhanced Uplink technology, allowing detailed testing and analysis
of complex packet-based services and applications.
High Speed Uplink Packet Access (HSUPA) provides a major
enhancement to the 3GPP roadmap. HSDPA-capable systems
enable advanced services and high data rates in the downlink,
HSUPA seeks to eliminate the bottleneck that is now present for
uplink services. In a similar way to the downlink HSDPA technology,
HSUPA offers enhanced uplink performance and spectrum
utilization in conjunction with packet switched technology. High
uplink data rates and reduced packet latencies are achieved using
enhancements including 2ms TTI packet data, HARQ and Node B
scheduling. Using multicode techniques, HSUPA offers uplink data
rates of up to 5.76Mbps.
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