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Strasbaugh Okamoto Disco

CMP Diamond Pad Conditioners - 29576 WAFER BACKSIDE GRINDING

Our wafer backside grinding tools positively impact your totalcost of ownership through:? Longer wheel life? Lack of nitride passivation ? Extremely low depth of sub-surface damage ? Strong, premium quality diamond ? High production up-time ? Extremely high die strength ? Reduced wheel dressing ATI’s wafer backside grinding tools are used for grinding Silicon,Silicon Carbide, Ti-Al Carbide and other challenging substrates in the Okamoto, Disco, Strasbaugh and G&N machines.
MOREINFORMATION We welcome the opportunity to address your individual questions. You may contact us via e-mail at cmp@abrasive-tech.com or visit our web site at www.abrasive-tech.com. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . abrasivetechnology
® CORPORATE HEADQUARTERS8400 Green Meadows Dr. PO Box 545 Lewis Center, Ohio 43035 USA (800) 964-8324 (740) 548-4100 Fax: (740) 548-7617 email:customerservice@abrasive-tech.com www.abrasive-tech.com EUROPEAN HEADQUARTERS Abrasive Technology, Ltd. Roxby Place Fulham, London SW6 1RTUK 44-20-7471-0200 Fax: 44-20-7471-0202 ©2001 Abrasive Technology Inc.